Robotic technology that combines IoT and autonomous driving technologies provides key solutions for future mobility manufacturing. Main Functions Innovative manufacturing system using Collaborative Robot and Autonomous Mobile Robot ptimize production processes and provide logistics flexibility Ensuring Optimal Production Process Using AI Application Site HMGICs : Flexible Production Cells (smart manufacturing) Targeted to supply to global manufacturing sites

Plane Windows are used as substrates for a variety of applications, such as laser window, output couplers, beamsplitters, beam combiners, mirrors, dichroic filters and plate polarizers. Considerations in selecting window substrates include transmission range, absorption coefficient, incident laser power density and environmental factors such as pressure, temperature, moisture, abrasion and corrosion. Plane Windows listed under UV / VIS / NIR substrates are specified for applications involving coating wavelengths 193nm ≤ λ〈2.0 μm. Units for these substrates are given in mm. Plane Windows listed under IR substrates are specified for applications involving coating wavelengths λ≥ 2.0 μm. Units for these substrates are given in inches. Refer to the THIN FILM COATINGS section for information on coatings that can be applied to these substrates.

Utilizing optics, sensors, and precision measurement technologies, Sodern offers competitive solutions in a variety of fields, including space exploration, military, and neutron analysis. Sodern has achieved consistent growth and success in the space, defense, and neutron analysis markets, and is recognized internationally as a trusted partner. - 1/3 of global satellites are equipped with Sodern - World's Largest Star Tracker Portfolio +150 satellites carry Sodern's star trackers +550 star trackers already ordered +10 million hours of operation with 100% mission success - Two production facilities dedicated to high-end and low-cost star trackers

SAR satellites are designed for change detection and our unique Dwell, Spot, Strip and Scan modes give you the flexibility to monitor very large areas and zoom in to areas of interest at ultra-high resolution as needed. Get unprecedented visibility and flexibility with Dwell, Spot, Strip and Scan imaging modes. Monitor areas up to 50,000 km² and zoom in to areas of interest at very high resolution down to 50 cm – day, night and in any weather

Optimized and qualified for next generation Electronic Control Units the Intercompact Series is an innovative solution for PCB to PCB and floating mouting rack and panel applications currently offered in both signal and Ethernet versions. Designed to meet the requirements of the rail and industrial environments, it is also suitable for other demanding markets such as defence, space and test & measurement.

The N Series of mini modular, high density connectors offers a variety of combinations in a single connector frame. It employs a do-it-yourself system based on the building block principle, which allows users to select the connector design that meets their specific requirements through off-the-shelf components.

GORE® SKYFLEX® Aerospace Materials are a portfolio of unique, commercially-available material sets, forms and sizes with a wide range of engineered properties and specifications. Gore’s tapes and gaskets are specified by leading civil and defense aircraft OEMs and solve many challenges such as sealing, abrasion, corrosion and gap filling. These materials can also withstand a wide range of temperatures.

We developed and optimized an object detection and tracking solution tailored for edge environments using Intel Atom platforms with OpenVINO. The system combines MobileNetV3-SSDLite for detection and MobileNetV3-Small for tracking, enabling efficient real-time performance on resource-constrained devices. Through model optimization and inference acceleration, we achieved over 2x improvement in FPS and more than 50% enhancement in inference speed, all while maintaining detection and tracking accuracy. This demonstrates the solution’s suitability for lightweight, low-power edge AI applications