Brazing is bonding two or more pieces of metal by means of flowing a filler metal between the joint interfaces at a temperature below the melting point of the base metal. The filler metal, upon cooling to the solid state, forms a strong metallic bond throughout the joined area. Through Dip-Brazing, RF Systems manufacture 1. Brazed Antennas 2. Brazed Waveguides 3. Brazed Divider / Combiner

12kW DBC HEL Source for C-UAS

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The VPX3-C11 which provides a full 3U OpenVPX(VITA 65) is a Single Board Computer(SBC) that combines the power, versatility, cost-effectiveness of the 11th generation Intel Xeon W processor and RM590E PCH chipset with the reliability. VPX3-C11 is based on the Intel Xeon W- 11865MLE CPU that has 8 cores running at max 4.5GHz and providing 32Gbytes of high-bandwidth DDR4 SDRAM. Intel Xeon processor includes an integrated Intel UHD Graphics 11th Gen(32 EU) graphics engine, providing discrete GPU performance with OpenGL for graphicsintensive applications. For storage application VPX3-C11 provides the built-in 80GB SLC NVMe SSD solution via PCIe x4 lanes as well as the external SATA expansion through VPX site. The VPX3-C11 satisfies the demanding applications ranging from tactical aircraft to armoured vehicles to rugged industrial systems, with its rich complement of features and I/O including Intel Graphics, Integrated Platform Management Interface, Gigabit Ethernet, DIO, Serial channels, USB ports and more. Especially VPX3-C11 was designed to keep the pin compatibility with VPX3-C11, previous 6th Generation model in terms of I/O interface signal arrangement.

A compact demonstrator aircraft derived from the B-33X platform, developed as a scaled model to showcase the core design and technology of SAMBOMOTORS’ next-generation large AAM. It retains the key aerodynamic and structural characteristics of the original model while optimized for testing, demonstration, and exhibition purposes.

Slice6 AIR, Slice6 Air BR 는 극한 시험 환경에서 아날로그 신호를 정밀하게 측정할 수 있도록 설계된 통합 데이터 수집 장비로, 크기, 무게, 전력(SWaP)에 최적화되어 제한된 공간과 질량 조건에서도 효과적으로 운용할 수 있습니다. 각 모듈은 마이크로프로세서, 이더넷 스위치, 신호 조정 회로, 비휘발성 메모리를 포함하고 있습니다. 독립형, 네트워크형, 기존 시스템 통합형 등 다양한 운용 방식에 대응하며, IRIG 포맷 기반 실시간 스트리밍과 이중 저장 기능을 통해 실시간 모니터링과 백업을 동시에 수행할 수 있습니다. Ethernet-based data acquisition unit (DAU) for flight test and ground shock test. SLICE6 AIR, SLICE6 AIR BR is a complete data acquisition unit for measuring analog signals in extreme test environments. Optimized for size, weight, and power (SWaP), SLICE6 AIR is ideal for applications with tight size and mass constraints. Each module features a microprocessor, Ethernet switch, signal conditioning, and non-volatile memory. The versatile SLICE6 AIR can be used standalone, networked for high channel count tests, or integrated into existing Ethernet-based flight test instrumentation. Real-time streaming in IRIG formats and dual store-in-place recording enables both real-time monitoring and redundant back-up of data on a single device.

ㅇKey Features - Low Dielectric Permittivity / Low Weight / Low Cost - Possible Customization - Operating Temperature : -40℃∼ +900℃ - Random Vibration : 6.1Grms , 20 Hz to 2000 Hz, 3 axis - Shock : 20 G (Minimum Peak) Sawtooth , 3 axis - Altitude : Up to 160,000 ft (0.929 mbar) ㅇQuality and Certification - MIL-STD-810G

- Detects fire through heat sources when installed in areas where optical fire detectors are difficult to apply, such as in the presence of contaminants or obstructed visibility - Capable of detecting fire even if the sensing line is severed - Length can be adjusted depending on the equipment applied