Confronting climate change, designing quieter and more efficient airplanes, developing innovative satellites to observe the Earth's system: our sector is using its skills to their utmost to take action for the environment. Our two main objectives are to advance our technologies so that we can better observe our planet and to create sustainable air travel.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

The lightest plate carrier 4-way stretch Tweave sewn internally for comfort Poly mesh cummerbund for increased ventilation Rear internal pocket for storage Elastic webbing straps for cable management PALS webbing for MOLLE attachment Removable front flap Zipper for DS Assaulter's Zip-On Back Panels QASM buckle System Available in different shapes depends on the plate thickness Soft armor can be added Composition Material : 500D Cordura® + ARAMID / PV® Size : Small : 8.5" x 11.5" Plate Pocket Medium : 9.3" x 12.3" Plate Pocket Large : 10" x 13" Plate Pocket XLarge : 10.9" x 13.8" Plate Pocket Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Features Solid-state, maintenance-free, modular components for optimal mounting of controls, sensor, and display Automatic compensation ensures the highest degree of accuracy (±1º) LCD display with adjustable backlighting for easy viewing in all conditions Variable control of electronic damping for use in rough seas Meets demanding military standards for years of reliable performance Dual compensation for degaussing on and off Applications Naval vessels including aircraft carriers, battleships Smaller naval boats Amphibious craft

GENASYS Ultra high-performance mixed signal test platforms deliver a no compromise functional test solution for satellite, airborne electronics, and other mission critical applications. The scalable architecture supports up to 4500 "any resource to any pin" interface test points and features best-in-class digital performance, with preconfigured Benchtop solutions addressing a broad spectrum of lower channel density applications.

< Frequency Range > ● 2500 ~ 6000 MHz < Output Power (W) > ● 35 < Gain (db) > ● 46 < Power Supply (V) > ● 30 < Current (A) > ● 10 < Dimension > ● 175.3 x 91.4 x 28 (mm)

In addition to stocking common grades, shapes and sizes, PASU has a full inventory of nonstandard sizes. Progressive’s multiple value-added processing capabilities provide the ability to supply near-net products resulting in reduced machining time. From 2 stocking locations (Hartsville, South Carolina & Las Vegas, Nevada) the company efficiently supports the North American market, with close proximity to international airports and major shipping ports on the east & west coast of the USA providing exceptional service to the global market. Progressive’s AS9100D Certified quality system is complemented with many major OEM Approvals including Pratt & Whitney - LCS. Specialty products include round bar, flat bar, plate & forgings in the following alloys: 17-4PH & 15-5PH 13-8MO 13-8 Supertough® 4340M (300M), 4330M, 4340 VAR Cronidur 30® Custom 455® & Custom 465® 440c & 440c VAR Value added processing capabilities include: Production cutting up to 22" diameter Plate processing up to 24" x 72" x 170" Waterjet cutting & near-net shape processing Grinding, trepanning & gun drilling Heat treating, destructive & non-destructive testing

We lead the latest technology trends with innovations in design and thickness. VITZROCELL's Thin film batteries are thin and flexible sheet-type batteries with various shapes and thicknesses.