Utilizing optics, sensors, and precision measurement technologies, Sodern offers competitive solutions in a variety of fields, including space exploration, military, and neutron analysis. Sodern has achieved consistent growth and success in the space, defense, and neutron analysis markets, and is recognized internationally as a trusted partner. - 1/3 of global satellites are equipped with Sodern - World's Largest Star Tracker Portfolio +150 satellites carry Sodern's star trackers +550 star trackers already ordered +10 million hours of operation with 100% mission success - Two production facilities dedicated to high-end and low-cost star trackers

The SC-SBCRTM-V2 is a Rear Transition Module (RTM) designed to extend the I/O functionality of the SBC6511 single-board computer. Mounted on the rear side of the main VPX backplane, this module provides additional I/O expansion through Micro-D and D-sub connectors for synchronization signals, two Ethernet ports, two Mini-DisplayPort video outputs, two USB interfaces, and MMCX connectors. It enhances system flexibility and connectivity for embedded and radar signal-processing applications.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

The ENS2000 (Sub-6GHz 5G small cell) is a small cell capable of providing 5G services with a coverage radius of several hundred meters. It supports operator 5G bands such as n78 (3.5GHz) and n79 (4.7GHz) for private 5G. Originally developed for indoor use, but it can also be installed in enclosures such as streetlight cabinets for outdoor deployment when needed.

We offer service centers and sales offices worldwide. Our service centers’ capabilities extend from specialized cutting to supplying parts cut to specific drawings and specifications, which reduce your labor time and material waste. We can be a partner in your entire material management system. We are continuously expanding our capabilities to increase your operation’s efficiency and shorten your cycle time. Our highly trained staff and technicians are dedicated to providing solutions that exceed your expectations. Some of our processing capabilities and value-added services include:

Whether you need on-demand delivery of finished goods, end-use technical support or a partner with a global presence, Haynes International provides value far beyond the alloys themselves.

- Provides accurate measurements of the trajectories of aircraft, guided weapons, separation of aircraft, and target encounters. - Using CW and FMCW

Development of an integrated support system for total life cycle management of weapon systems

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.