Building secure, robust and reliable electronic systems for aerospace and defense applications is critical. You can take advantage of our extensive expertise and technical support to reduce your integration risk and development time. Our development ecosystem includes IP licenses, a variety of demonstration and evaluation kits, reference designs, software, application notes and detailed documentation. Our team of engineering, sales, marketing, logistics and quality experts provide the specialized support that you need to solve your most difficult design challenges.

Vulcanized Bonding - Complex Elastomer-to-Metal Bonding

- 3 axis Fiber Optic Gyroscopes / 3 axis MEMS Accelerometers - Operating Range: ± 490º/sec - Bias Repeatability(over temp. range) : ≤ 0.5º/hr (1σ, RMS) - In-run Bias Stability: 0.03º/hr (typical, 1σ) ≤ 0.05º/hr (max, 1σ) - Angle Random Walk : 0.025º/√hr (typical, 1σ) - Power Consumption: 5W @ 25℃ (< 8 W, @ - 40℃) - Input Voltage: + 5 V Lightweight Package: 790g (1.74 lbs)

Additive manufacturing: - allows highly efficient, compact recuperators with custom flow paths, maximizing energy recovery and reducing overall system emissions. - charge air coolers enhance cooling performance with tailored airflow designs, reducing intake temperatures and boosting engine efficiency. - delivers precise, space-efficient pre-coolers and heaters, ensuring optimized thermal response and energy efficiency for various industrial applications.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

Lumir, in collaboration with the Electronics and Telecommunications Research Institute (ETRI), developed and integrated this device for lunar exploration aboard Danuri (KPLO, the Korea Pathfinder Lunar Orbiter), Korea's first lunar probe. This device successfully demonstrated its performance by receiving BTS music videos transmitted from the Moon to Earth, achieving Technology Readiness Level (TRL) 9.

The ENS4000(Sub-6 5G Outdoor base station) is designed for outdoor services in the n79 (4.7GHz) band, providing coverage on the kilometer scale and enabling seamless private 5G service even in outdoor environments.