KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

TERRAPIN X is a rugged handheld laser rangefinder by Safran Vectronix, offering up to 3,000 m range with 8× magnification, Class 1 eye-safe laser (905 nm), and a 28 mm objective lens. It features precise beam divergence (1.2 × 0.5 mrad), slope and azimuth compensation, scan mode (≥2 readings/sec), and durable Ryton® housing with shock-resistant rubber armor (IP67). Advanced Bluetooth connectivity integrates with mobile apps and devices such as Kestrel LiNK, Garmin, Strelok Pro, and includes a dedicated smartphone app.

Premium refined titanium ingots, manufactured using imported high-purity titanium sponge and subjected to a minimum of two VAR (Vacuum Arc Remelting) processes. Forged to meet customer requirements, available in various semi-finished forms (bar, plate, ring) for defense and display industries.

It is an UAV recovery system that lands a fixed-wing UAV even in mountainous terrain where there is no sufficient runway for landing. The UAV is damping through a net mounted on the vehicle and lands on an air-cushion mat. It has the advantage of being easy to deploy in places where vehicles can enter and exit. But the type of the aircraft capable of stable landing is limited.

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

ORSKOREA’s cylindrical grinding machines are engineered to deliver superior surface quality and tight tolerances for high-value parts. They are widely used in aerospace, defense, automotive, medical, and electronics industries for components that demand both strength and precision—such as engine shafts, landing gear parts, gears, and bearings. Key Advantages • Handles diverse, small-batch productions with consistent repeatability • Exceptional dimensional precision for tight-tolerance parts • Supports tapered and curved surface grinding • Flexible workpiece capacity with swing up to 350 mm • Smooth table movement with low noise and vibration for stable operation By combining precision, versatility, and long-term reliability, ORSKOREA’s cylindrical grinders provide manufacturers with the performance needed to meet mission-critical requirements.