A cost-effective and reliable EO/IR solution designed for unmanned platforms, combining compact design with strong performance. The system integrates QVGA/VGA-class infrared sensors and 2–20 megapixel EO cameras, providing versatile options to meet different operational requirements. o Infrared (IR) Sensor: QVGA/VGA resolution, optimized for detection and recognition in short-to-mid range surveillance o Electro-Optical (EO) Module: 2MP–20MP visible light cameras with high-resolution imaging, adaptable to multiple mission profiles o Design Philosophy: Lightweight, compact, and robust for integration into unmanned aerial vehicles (UAVs), unmanned surface vehicles (USVs), and ground robotics o Key Value: Balances price competitiveness, system reliability, and modular scalability for mass deployment

InspecX is a next-generation autonomous swarm inspection system for aircraft. It is addressing challenges in the $100B global aviation maintenance market. Airlines face a shortage of certified technicians, with Boeing projecting demand for over 700,000 by 2044. Aircraft-on-ground (AOG) incidents cost $10,000–$150,000 per hour, making downtime reduction critical. InspecX uses swarm coordination and LiDAR-based SLAM to perform safe inspections in GNSS-denied or indoor environments. It reduces required technicians from 9 to 3 and inspection time from 10 hours to 3, achieving over 50% cost savings for large aircraft. Beyond efficiency, InspecX helps airlines avoid AOG losses, accelerates maintenance cycles, and improves airworthiness. By maximizing fleet readiness and ensuring reliable operations, it provides a scalable, future-proof solution. InspecX is positioned to become the new global standard for aviation safety and maintenance in the era of intelligent mobility.

The focus on buy-to-fly ratios highlights the contributing role that near net shape processing can offer. This has undoubtedly been a driver in increasing this service offering from AMA. As a major contributor in the aircraft manufacturing supply chain, this is a key area of development for AMA and its companies. Customers are increasingly looking to optimise their production processes. This is primarily driven by the need to maximise their own spindle time for core business activities, with AMA therefore undertaking some of the machining processes. It can take many forms, from simple cutting to more intricate processing in which near net shape pieces are supplied. Even in AMA businesses whose business is predominantly transactional (so called ‘spot business’) rather than contractual, the processing element is increasing. Pre-machined kits of parts to individual specifications are becoming more commonplace. In addition to freeing up time for customers and OEMs to focus on more profitable final processing, near net shape processes can improve product quality, reduce variability and enhance component design functionality. As the industry continues to search for ways to lower buy-to-fly ratios and reduce the amount of waste, near net shape processing will have a greater role to play.

Discover the superior technology and reliability of the SBC3513L, crafted to provide unparalleled performance and security for critical applications. • Powered by Intel® Xeon® W processors, offering robust computational power. • Extensive I/O options including Ethernet, USB, and DisplayPort for versatile connectivity. • Supports Time Sensitive Networking (TSN) for precise and reliable network communication.

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

The EL2000 is an LTE femtocell developed for indoor use, providing seamless LTE service in environments such as homes or offices.

The SC-SBCRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the SBC627. When the SBC627 board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-SBCRTM board into the back of the Backplane.

P6P series piston type pressure switch