High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

Based on GaN, Si RF, and GaAs processes, Advance RF provides integrated solutions from chip design to modules and systems. We supply high-performance, highly reliable RF products for wireless infrastructure, satellite communications, automotive electronics, industrial measurement, and aerospace. Advance RF's product line consists of GaN, GaAs, and Si RF-based products, and in various configurations, covers a wide frequency band from DC to 100 GHz. Advance RF provides high-performance RF solutions optimized for a variety of applications, and its broad product portfolio allows for flexible design responses to customer needs. We have a rapid development cycle and stable mass production capabilities that enable rapid response to new sampling. Based on our own assembly plant, we maintain a development and mass production system capable of handling all aspects of customization, modularization, and reliability testing in-house.

A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

DA 22-BLDC Brushless Actuator To guarantee maximum safety and reliability, its brushless motor and contactless, wear-free position sensing system makes the DA 22 BLDC immune to wear, vibrations and shock loads. It has especially been designed for usage in harsh environments and for safety-critical applications that require an actuator with high endurance. The conductive aluminum case and the shielded connection cable are reducing the susceptibility to any kind to EMI/RFI noise to the absolute minimum.

Spacecraft are exposed to extreme conditions that can jeopardize signal transmission capabilities, making it impossible for repairs in space. Whether traveling millions of miles for exploration or enabling global connectivity, space programs need durable solutions with reduced size and weight they can trust to perform without failure. W. L. Gore & Associates answers the call with small, low-mass GORE® Spaceflight Microwave/RF Assemblies proven to maintain electrical and mechanical performance in the harshest environments, ensuring mission readiness and success.

The ACTUS® ARKS18 (1–8X28mm FFP) Riflescope is built to deliver precision and durability, meeting the demands of professional users across diverse environments. Featuring a First Focal Plane (FFP) optical design, it ensures fast and accurate target coverage at any magnification level. The illuminated reticle provides smooth and reliable targeting, even in low-light conditions like dawn or dusk. Whether in dynamic or harsh environments, the ACTUS® ARKS18 is the ultimate riflescope to meet the needs of users who require top-tier performance when it matters most.

Supports non-destructive inspection of aircraft composite skin structures and is composed of a piezoelectric layer sensor, data acquisition equipment, and damage analysis software. Utilizes piezoelectric sensors to generate Lamb-wave and acquire signals, collecting data to accurately detect and assess composite damage. Visualizes inspection results on display such as damage location, size and index. - POD Accuracy: 1 inch 90% or more - POD Precision : Position error within 30 mm - 64 channels / 230 path reference detection time within 10 minutes - Sensor : Resonance resistance less than 400kΩ - Sensor : MIL-STD-810G - Sensor : RTCA DO-160 Section 23.0 - DAQ : x128 Piezoelectric sensor interface

Original compact design and long-term production know-how. System reliability and overall competitiveness.