FRAZIER AVIATION'S Manufacturing Resource Planning is defined by APICS as a method for the effective planning of all resources of a manufacturing company. Ideally, it addresses operational planning in units, financial planning in dollars, and has a simulation capability to answer "what-if" questions and extension of closed-loop MRP.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

BAE Systems' ground-launched APKWS® laser-guided rocket provides precision strike capabilities on the move. The hardware is compatible with existing turret r...

Purposed for people carrying two or more radios (JTAC, LEADER, RTO, etc) Removable shoulder & waist straps can be adjusted to fit the end-user without removing the rack Attaching to select tactical plate carriers with the QASM buckle system or using stand-alone with H Harness Small 4-way stretch Tweave general purpose pouch (Qty.1) Magazine pouches for 5.56mm or 7.62mm mags (Qty. 2) PRC-152A or 148 radio pouches (Qty. 2) Removable antimicrobial/FR treated spacer mesh pad Compatibility : PICO-DSX, PICO-DS, PICO-MBAV, EPIC-FED, EPIC-LOC-MOL & EPIC-DSX Composition Material : 500D Cordura® + ARAMID / PV® Color : MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

GE's T901 Engine for ITEPA test cell is not a combat mission. In combat, there is no time for an unproven design. With more than 100 million flight hours of ...

ABC leader in test bench has a highly skilled automation service with technicians trained on different PLC platforms and displays from major manufacturers such as SIEMENS, SCHNEIDER, IFM, OMRON, PROFACE, ... The automation engineers are involved in preliminary design to help define customer needs and guide project managers in the possibilities of architecture and machine ...

The KX2-2046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 20W saturated output power with power-added efficiency of 46%. The KX2-2046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX2-2046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-11.5GHz - Small Signal Gain: 26dB - High Pout: 20W - High PAE: 46% - DC bias: Vd=28V @Idq=0.3A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x1.66x0.1mm  

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.