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In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

Robotic technology that combines IoT and autonomous driving technologies provides key solutions for future mobility manufacturing. Main Functions Innovative manufacturing system using Collaborative Robot and Autonomous Mobile Robot ptimize production processes and provide logistics flexibility Ensuring Optimal Production Process Using AI Application Site HMGICs : Flexible Production Cells (smart manufacturing) Targeted to supply to global manufacturing sites

It is especially suited for demanding applications, which require reliable performance, such as missile seeker gimbal stabilization, where small size and low power consumption is required, while in a low cost design that is also ideally suited for high volume commercial applications. System Performance PARAMETERS SPECIFICATIONS Standard Ranges ±100°/sec, ±200°/sec, ±400°/sec Input Voltage + and - 5.0 Vdc Bandwidth 110 Hz Output Noise < 005°/sec/√Hz Scale Factor Accuracy ±1% Nominal Features Dual Axis Capabilities in Small Form Factor Miniature Size: Only 25gm.(1.05” x 0.71” diameter) Hermetically Sealed In Stainless Steel Cylinder High Reliability DC Input/High-Level DC Analog Output Low Cost Applications Tank Turret Stabilization Missile Targeting Platform Stabilization Antenna Stabilization Camera Stabilization Spacecraft

A device that filters outside air through a filter of a positive pressure device during chemical warfare

PELICAN-D LW is a 640x512 elements, 15μm pitch, Type-2 SuperLattice (T2SL) technology based 2D Long Wave Infrared (LWIR) digital IDCA. The new ROIC outputs digital signal, similarly to SCD’s previous digital detectors: Sebastian-320, Sebastian-480, Sebastian-640, Pelican-D, Hercules, and Blackbird. Pelican-D LW is available in the same configurations as the standard (MW) Pelican-D, with a large variety of cold shield apertures and cooler types. The proximity board provides the FPA timing and sensitive power supplies. Camera-Link interface highly simplifies the integration of the detector to the system.

The GRA117S is a rugged 3U VPX SOSA-aligned video graphics and GPGPU card delivering high-performance AI and graphics with the NVIDIA RTX™ 5000 and PCIe Gen-4 connectivity. • NVIDIA RTX™ 5000 (Ada Lovelace) GPU: 16 GB GDDR6 ECC, 9,728 CUDA/76 RT/304 Tensor Cores • PCIe Gen-4 interface, AV1/H.264/H.265 codecs, GPUDirect RDMA • Rugged design: conformal coating, air- & conduction-cooled, −40–71 °C range • SOSA slot profiles 14.6.11 & 14.6.13 compliant • Windows/Linux drivers, CUDA/CUDA-X/OpenCL support

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.