The iGRVT-50 is InterGravity Technologies’ next-generation green-propellant orbital transfer vehicle (OTV), purpose-built for the rideshare launch ecosystem. iGRVT-50 enables small payloads (up to 15–20 kg class) to be deployed or serviced in a wide range of orbits. Key Features - Payload Capacity : Up to ~20 kg class hosted payloads - Propulsion System : 20 N green bipropellant thrusters (C₂H₆/N₂O) - Delta-V Capability : > 450 m/s - Communications : UHF, S-band TM/TC, X-band downlink

SJP’s special parts are custom-designed and manufactured to meet unique requirements that standard components cannot fulfill. With our advanced R&D capabilities and state-of-the-art CNC multi-tasking machines, we handle complex geometries, tight tolerances, and special materials with precision. These parts are widely used in medical devices, semiconductor equipment, precision instruments, and aerospace & defense, where reliability and high accuracy are essential. From rapid prototyping to full-scale production, we deliver end-to-end solutions that shorten development cycles and enhance product competitiveness.

LW-DED 3D printing head module for Morphing Shield Technology. Morphing Shield Technology builds aportable inert gas enviroment surrounding the melting zone for laser wire DED Process.

Seedcore’s VPX Chassis Housing Assembly is designed as a structural platform for Multi-function radar signal processing systems. Featuring a robust 8U 2×5 slot VPX configuration, precision-machined aluminum construction, and excellent thermal management, it ensures high mechanical stability and optimal heat dissipation in demanding defense environments. This chassis housing is deployed in Korea’s key air defense radar systems, including the L-SAM, M-SAM, and LAMD programs, supporting mission-critical radar signal processing architectures.

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.

It is a product lineup that is proven in global markets and has world-class competitiveness. And it is being exported to more than 20 countries around the world.

1. The recorded flight and voice data are securely stored on crash-protected memory, both fixed-installed and deployable. 2. This proven FDR with legacy is available for rotary and fixed wings for military but also for civil application like Urban Air Mobility(UAM). 3. It is a All in One recording, Innovation in lightweight solutions,certified by European Airworthiness Certification Authority that secures the aviation safety.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.