33 GHz Mixed Signal Oscilloscope; 4 analog / 16 logic channels

Key Features Enhanced speed and precision with a powerful 30W laser Supports a wide range of high-performance materials including Nylon 11, Nylon 12, and TPU Dimensions: 685 x 645 x 1065 mm Build Volume: 165 × 165 × 300 mm Weight: 114 kg (excluding build chamber or powder) Specifications 30W fiber laser Maximized powder reuse to minimize material waste ________________________________________

HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.With a 0.6mm contact diameter, the HPH Series comes in 3-6 row configurations and is available up to 303 signal contacts on a 1.901mm staggered grid. Contacts are removable for ease of maintenance.

The engine is suitable for MALE AUVs. Available in pusher and tractor configurations. Digital interface for control and monitoring. Stable operation at high altitudes and high temperatures. Ability to run at cold temperatures below -30°C without preheating.

The NSP-2 is designed for integration on Modular-Payload (MP) compliant Unmanned Airborne Systems (UAS), and each unit undergoes thorough testing to ensure its reliability. Instead of a mechanical gimbal that requires regular maintenance, IMSAR’s NSP-2 uses an innovative 2D Electronically-Scanned Array (ESA) antenna to enable quick scanning in both azimuth and elevation. The NSP-2 works in the Ku-band using multiple modes, such as Synthetic Aperture Radar (SAR) imaging, Magnitude Change Detection (MCD), and Ground and Maritime Moving Target Indication (MTI) at low altitudes.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.