The HPD/HPF PCB Connectors series is crafted with precision, integrating advanced Hypertac contact technology for dependable connectivity. With a lifespan of up to 100,000 insertion/extraction cycles, these connectors ensure consistent performance in challenging environments. They feature optimized power efficiency and strong high-current handling capabilities, enhancing system efficiency while maintaining reliability. Engineered to withstand tough conditions, these connectors offer robust connectivity solutions across various applications, promoting seamless operation, productivity, and long-term dependability for your systems.

Micro-D Twinax Connectors (MDTX) offer Twinax blindmate assemblies fitted into a low-profile metalized Micro-D style shell, high speed signalling capable of 100 Ohm differential pair matched impedance, maximum space utilization, ultra miniature size and high vibration capability, extremely light weight and modular with true signal integrity.

The focus on buy-to-fly ratios highlights the contributing role that near net shape processing can offer. This has undoubtedly been a driver in increasing this service offering from AMA. As a major contributor in the aircraft manufacturing supply chain, this is a key area of development for AMA and its companies. Customers are increasingly looking to optimise their production processes. This is primarily driven by the need to maximise their own spindle time for core business activities, with AMA therefore undertaking some of the machining processes. It can take many forms, from simple cutting to more intricate processing in which near net shape pieces are supplied. Even in AMA businesses whose business is predominantly transactional (so called ‘spot business’) rather than contractual, the processing element is increasing. Pre-machined kits of parts to individual specifications are becoming more commonplace. In addition to freeing up time for customers and OEMs to focus on more profitable final processing, near net shape processes can improve product quality, reduce variability and enhance component design functionality. As the industry continues to search for ways to lower buy-to-fly ratios and reduce the amount of waste, near net shape processing will have a greater role to play.

Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

MOSKITO TI is a monocular that includes all essential target observation, range finding and geo-location functions, by day and by night, as well as state-of-the-art connectivity to battlefield management solutions. This extremely powerful and light laser rangefinder is operated with four CR123 batteries. Regular software updates keep this device ready for all future mission requirements.

Between Earth and space: stratosphere-compatible, solar-powered high-altitude aircraft, known as HAPs (High Altitude Platforms), offer a sustainable alternative to satellites for Earth observation and communication. They are reusable, cost-effective and flexible in use. The DLR joint project HAP-alpha is developing such a technology demonstrator and is endeavoring to establish a complete system capable of permanent operation. The aim is for DLR to build up comprehensive expertise for the development of high-performance, high-flying solar aircraft and to play an active role in shaping the legal framework. In summer 2025, the HAP-alpha successfully passed a ground vibration test.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

With advanced 3D printing, our turbine blades redefine manufacturing—delivering faster development, higher efficiency through superior quality, and innovative design freedom.