We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.

Development of an integrated support system for total life cycle management of weapon systems

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm  

Rolatube Tripods are purpose-built for applications where mobility, speed, and performance matter. Constructed from Rolatube’s patented rollable composite material, each tripod offers a durable yet lightweight structure that rolls or folds down for easy transport and storage. Designed to support a range of payloads and mission profiles, the lineup includes the highly portable System 30, versatile Industrial Compact Tripod, and robust System 50 Tripod MIL for demanding field operations. These tripods are engineered for rapid deployment and compatible with Rolatube masts or other payloads requiring stable elevation. Their corrosion-resistant build, compact footprint, and tool-free setup make them ideal for communication, surveillance, and sensor support across defence, emergency response, and industrial sectors.

Rolatube IAM (Integrated Antenna Mast) is a lightweight, man-portable communications mast that integrates a high-efficiency dipole antenna directly into its structure—redefining rapid tactical deployment. Built from Rolatube’s proprietary bistable composite, the IAM unrolls to full height without tools, enabling users to connect and transmit in seconds. Available in 3.5 m and 7 m models, the mast weighs just 1.9 kg and packs down to a 150 mm roll, offering unmatched portability for dismounted operations. Designed for reliable RF performance, the IAM ensures no signal loss when in contact with grounded surfaces. Its embedded omni-directional dipole antenna delivers superior range and VOR communication performance compared to traditional systems. The 3.5 m IAM comes in VHF (30–300 MHz) and UHF (136–470 MHz) variants, each available in four colours, with a top-cap socket for L-Band antenna integration, extending the system’s use to applications such as telemetry, GPS, and aircraft surveillance. The mast can be handheld, guyed, or elevated via an integrated rigging point, and is engineered to meet MIL-STD-810G, fully maintenance-free, and resistant to water, dust, and UV. With a wind rating of 100 km/h (62 mph) when guyed, the IAM stands up to demanding field environments while delivering high-performance, elevated communications infrastructure at the tactical edge.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

1. Integrated Production System Equipped with in-house CF-SMC compression molding equipment, we provide a complete one-stop solution—from sheet production to final composite molding—tailored to customer requirements. This ensures both exceptional quality and production efficiency. In line with ESG management, we also utilize our proprietary recycled carbon fiber technology to recycle CFRP waste generated during CF-SMC production. 2. Moldability & Productivity ILSUNG’s carbon fiber SMC technology offers superior moldability compared to conventional continuous CFRP and aluminum. With a rapid curing speed of about 1 minute per 1 mm thickness, it enables high-speed, mass production. Complex and precise geometries can be molded reliably, delivering strong competitiveness for both simple and highly engineered components. 3. Exceptional Lightweight Performance CF-SMC has a lower density than aluminum castings while maintaining high mechanical strength, delivering the optimal lightweight solution for industries where weight reduction is critical. 4. Balanced Performance This technology not only achieves lightweight properties but also ensures a well-balanced combination of mechanical strength, corrosion resistance, dimensional stability, and durability. It maintains stable performance under extreme environments and repeated loads, making it highly suitable for automotive, aerospace, and defense applications where reliability is critical. 5. Cost Competitiveness Compared to CFRP, it provides a lower-cost structure and high-speed molding capability, ensuring excellent price competitiveness. This significantly improves cost efficiency in industries that demand large-scale production—such as automotive, aerospace, and defense—and strengthens its growth potential within the composites market.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.