Optimized and qualified for next generation Electronic Control Units the Intercompact Series is an innovative solution for PCB to PCB and floating mouting rack and panel applications currently offered in both signal and Ethernet versions. Designed to meet the requirements of the rail and industrial environments, it is also suitable for other demanding markets such as defence, space and test & measurement.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

An electric motor that supplies power to the actuator for opening and closing the KF-21 canopy.

GE and Safran are evaluating several promising architectures as part of their technology maturation plan. The most ambitious, the one that will yield the gre...

“The Meeting Point” is a private lounge where exhibitors can meet with guests, take a break from the show floor, and connect with industry peers. The Kallman Café serves refreshments throughout the day, offers a place to charge your phone, and provides exclusive WiFi service.

The PolarFire FPGA and PolarFire SoC families already deliver the industry’s best thermal and power efficiency in the mid-range segment. Optimized for deploying systems with high-compute performance in small form factors, the families have reduced the size and weight of power-constrained systems in applications including industrial imaging, robotics, AI-enabled medical systems and smart defense and aerospace systems.

Threaded bushing enables localized reinforcement of and attachment to panel structure. Supplied with disposable installation fixture. 1.25" Flange Diameter. SIZES: Imperial fine thread sizes from 10-32 (.190"-32) to 3/8-24 (.375"-24), Imperial coarse thread sizes from 8-32 (.164"-32) to 3/8-16 (.375"-16), and metric thread sizes from M5 to M8. 1.25" Flange Diameter. Grip lengths from 0.25" to 1.50". MATERIALS: Aluminum, 300 Series Stainless Steel, A-286 Stainless Steel, 316 Stainless Steel, and Titanium. Optional epoxy primer. FEATURES: Standard 1.25" diameter flange, 0.75" x 1.25" trimmed flange optional.

[LEO GNSS-R] Satellite : LEO RF Characteristics : GPS L1/L5, Galileo E1/E5a(option) Accuracy : Position ≤ 10m(3DRMS), Velocity : ≤ 1m/s Raw Data Accuracy : Pseudo-Range : 1m(RMS) Carrier-Phase : 10mm(RMS) Data Output Rate : 1Hz 1PPS Accuracy : Sync to GPS Time Data < 1us (1PPS Accuracy < 1.5us) TTFF : Cold Start ≤ 20min / Warm Start ≤ 10min Dara Interface : MIL-STD-1553B, RS-422(Data Interface) [GEO GNSS-R] Satellite : GEO RF Characteristics : GPS L1/L2C/L5, Galileo E1 Accuracy : Position :: ≤ 30m(3DRMS), Velocity : ≤ 1m/s Raw Data Accuracy : Pseudo-Range : 1m(RMS) Carrier-Phase : 10mm(RMS) Data Output Rate : 1Hz 1PPS Accuracy : 2us(RMS)/Sync to GPS Time Data TTFF : Cold Start ≤ 45min / Warm Start ≤ 20min Dara Interface : MIL-STD-1553B EEE Parts : ITAR Free Parts