The mmWave 5G small cell provides ultra-broadband service in the n257 (28GHz) band, delivering higher data capacity than n79 (4.7GHz) small cells. It supports NSA mode via EN-DC or NR-DC with LTE and 5G NR Sub-6GHz base stations, and can also operate in SA mode as a standalone mmWave service.

Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. Welcome to Microchip, we hope to partner with you on a future project. We believe together we can accomplish anything.

The MAGIC1A is a rugged 3U VPX SWaP-C3 high-performance embedded computer combining an Intel Xeon E3-1505M v6 CPU and NVIDIA Quadro P2000 GPU, offering strong compute performance, broad I/O, rugged resilience, and flexible software support. • Xeon E3-1505M v6 quad-core CPU + Quadro P2000 GPU → ~2.3 TFLOPS • Ethernet, USB, serial, MIL-STD-1553, ARINC 429, DisplayPort/DVI, GPIO; up to 8 TB removable SSD with fast-purge • MIL-STD rated, baseplate or fan cooling; −40 °C to +65 °C range • Supports Linux/Windows/VxWorks & CUDA/OpenCL/DirectX/OpenGL; includes AXIS software toolkit

The Nebula connector employs the renowned Hypertac hyperboloid contacts as the bedrock of its high reliability providing immunity to shock and vibration fretting and over 100,000 mating cycles. These features combine with current carrying capacity up to 1.5 Amps per contact and low insertion / extraction forces to provide significantly enhanced quality and reliability performance compared with other more commodity connector solutions. Available for direct mounting to PCB, the Nebula Series supports independent function for all its 22 contacts. It also offers optional quarter-turn locking hardware for faster connector securing and to prevent unintentional separation.

Green Optics possess proprietary CVD-based Zinc Sulfide (ZnS) production technology for defense and industrial multi-wavelength optical materials. We have core technological capabilities to manufacture high-quality ZnS products tailored to meet diverse customer requirements. ZnS Material Optical Performance and Processing ZnS materials produced through CVD processes provide high transmittance exceeding 70% in the SWIR wavelength range (8-12 μm). When these materials undergo additional Hot Isostatic Pressing (HIP) treatment, the crystal structure undergoes recrystallization, improving transmission characteristics to achieve over 70% transmittance in the visible (VIS) wavelength range of 0.45-0.8 μm. This process extends the application range of optical materials previously limited to SWIR and LWIR bands, delivering superior optical performance across multi-wavelength regions from VIS to LWIR. Material Specifications: - STD-ZnS (Standard ZnS Material): Manufactured via CVD process, exhibits transmittance exceeding 70% in LWIR wavelengths (8-12 μm) with high physical hardness (Knoop hardness: 210 kgf/mm²). - MS-ZnS (Multispectral ZnS): Converted from STD-ZnS through HIP processing, extends wavelength range into the visible spectrum. While crystal structure recrystallization during this process reduces hardness somewhat (approximately 150 kgf/mm²), it still meets MIL specifications. This dual-processing approach enables comprehensive wavelength coverage while maintaining military-grade durability standards.

Every feature designed with transparency and openness in mind. Access enterprise-grade quantum computing with the tools you need to innovate.

WORKS is a powerful CAD utility suite developed by ZYX Technology, designed to enhance drafting productivity through automation and specialized tools. It includes over 450 features tailored for civil engineering, architecture, and general 2D drafting work. A key advantage of WORKS is its dual compatibility—it works seamlessly with both ZYXCAD PRO and AutoCAD Full versions, making it an excellent solution for organizations using diverse CAD environments. WORKS automates repetitive drafting tasks such as block insertion, layer control, dimensioning, annotation, and bulk editing. For civil engineering workflows, it offers advanced tools like terrain cross-sections, longitudinal profile creation, drainage design, and grading support. In architectural drafting, WORKS streamlines operations like door/window placement, wall dimensioning, floor labeling, and symbol standardization. These features reduce manual errors and improve consistency and output quality. Its smart batch-editing functions and preconfigured settings allow users to apply company CAD standards easily, reducing project setup time and improving team collaboration. All tools are organized in an intuitive ribbon interface, allowing both beginners and experts to maximize productivity. By minimizing repetitive work and standardizing key processes, WORKS dramatically improves drawing efficiency and accuracy. It is trusted by government agencies, educational institutions, and enterprises for large-scale design projects across Korea and beyond. Whether you're creating road plans, site layouts, floor plans, or technical diagrams, WORKS simplifies complex workflows and saves time without compromising quality.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.