The CAS-500(Compact Advanced Satellite), phase #1 project is the project in which KAI aims to develop a CAS500-1 by operating a joint design team with Korea Aerospace Research Institute(KARI) and to transfer the government’s satellite development technology to the industries. Then, KAI initiates the development of the CAS500-2 project and establish the industry-led development as well as mass-production infrastructure.

The operation of robotic inspection systems in an industrial environment requires a reliable control station. The second generation integrated control station -ICS 2- gives operators an all-in-one tool. Supplied in a rugged hardshell case (Pelicase®), embedded components such as a 21.5-inch touchscreen, high-performance PC or joystick can be selected according to industry standards. It also boasts a 10-year spare parts guarantee as well as extreme robustness and reliability even in harsh environments. Simplicity and ease of operation were key when developing ICS 2. The operator connects the robotic platform with one single cable and using the integrated joystick, operation is simple and self-explanatory.

Power Supply 0...80V 0...510A 15000W

The MAGIC1A is a rugged 3U VPX SWaP-C3 high-performance embedded computer combining an Intel Xeon E3-1505M v6 CPU and NVIDIA Quadro P2000 GPU, offering strong compute performance, broad I/O, rugged resilience, and flexible software support. • Xeon E3-1505M v6 quad-core CPU + Quadro P2000 GPU → ~2.3 TFLOPS • Ethernet, USB, serial, MIL-STD-1553, ARINC 429, DisplayPort/DVI, GPIO; up to 8 TB removable SSD with fast-purge • MIL-STD rated, baseplate or fan cooling; −40 °C to +65 °C range • Supports Linux/Windows/VxWorks & CUDA/OpenCL/DirectX/OpenGL; includes AXIS software toolkit

The SCXMC-HDLC card operates through the XMC interface of the SBC and provides real-time communication for control and status data based on synchronization signals. It supports serial communication via the SBCRTM’s Micro D-sub 37-pin connector using a standard D-sub 9-pin interface, allowing long-distance transmission through LVDS signaling. With four transmit/receive channels, it achieves 1–8 Mbps per channel and delivers low-latency performance of less than 40 µs for real-time operations. A device driver program is required for operation, and the Linux driver can be downloaded from Seedcore’s product page. Drivers for other operating systems can be developed upon request. This module is deployed in the L-SAM multi-function radar system, enabling fast and reliable control data communication across mission-critical components.

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

< Frequency Range > ● LB-400: 400 ~ 460MHz ● LB-900: 800~928MHz ● MB-1500: 1300~1500MHz ● MB-2400: 2400 ~ 2500MHz ● HB-5.2: 5150 ~ 5250MHz ● HB-5.8: 5725 ~ 5875MHz < TX path output Power (at antenna port) > ● Normal mode: 35dBm [min] ● On each antenna port 2x 35dBm ● Interference mode: 40dBm [min] < TX path maximum Input Power > ● +20 dBm < RX path Gain > ● 25dB typ. < RX path Noise figure > ● Low bands: 3dB max. ● High bands 3.5dB max. < RX path IIP3 > ● -10dBm typ. < RX IP1dB compression point > ● 15dBm typ. < Power Supply > ● +24V ± 1 Vdc

Titanium Grade 1 -Strip Titanium Grade 2 -Bars-Sheets and Plates-Tubes and Pipes Titanium Grade 4 -Bars-Sheets and Plates-Wire Titanium Grade 5 (6Al-4V) -Bars-Sheets and Plates Titanium Grade 5 ELI -Bars-Sheets and Plates Titanium Grade 7 -Bars-Sheets and Plates-Tubes and Pipes Titanium Grade 9 (3AL2.5V) -Tubes and Pipes Titanium Ti-6Al-7Nb -Bars