# Key Features - Map Generation and No-Drive Zone Setting in Airports > Airport map/sensor fusion-based localization function > Function for defining main movement and standby areas > No-drive zone setting - Optimal Path Autonomous Driving Function > Destination-based optimal path navigation > Speed limit settings by path and area > Real-time location monitoring > Obstacle detection and immediate response > Driving on diverse road surfaces within designated areas - Real-Time Bird Detection and Bird Position/Direction Prediction > Real-time bird detection > Support for approximate bird position/direction prediction based on object detection algorithms > Updating of approximate bird position/direction prediction based on flock detection - Effective Bird Deterrence Reflecting Bird Characteristics > Playback of diverse (randomized) acoustic patterns - Real-Time Communication with Operator and Manual Control Function > Monitoring console (PC) provides real-time bird detection status and history > Display of approximate bird position/direction predictions on a map > Real-time video data sharing > Remote manual control - Smart Charging Function > Automatic return and charging when mission is complete or battery is low

We are Hyundai Steel, a member of Hyundai Motor Group, developing advanced composite parts for aircraft and AAM, with a focus on both structural and exterior applications. Using our rapid press-forming process, we can manufacture high-quality components in under 30 minutes, enabling faster production cycles and reliable performance. We also bring prior experience in small-scale production of automotive composite parts, strengthening our expertise across industries. If you are seeking to enhance the productivity of your composite parts, please feel free to contact us anytime for collaboration.

FLAMEMASTER has formulating and compounding capabilities for sealants, adhesives, and coatings made from polysulfides, epoxies, silicones, and rubbers, among others. The product line includes corrosion-resistant materials, mid- and lightweight sealants, electrical potting compounds, and thermal barriers.

The Ku-band Amplifier Module is a low-power amplifier designed to amplify the LO (Local Oscillator) frequency in the Ku-band. It provides a gain of at least 17 dB and an output level of 13 dBm or higher. The module includes a built-in monitoring function for output signal detection.

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm  

When your missions take you into extreme environments, the Bell 412 will always have your back. With the cabin you need for passengers and cargo, nothing and no one will get left behind.

The Nebula connector employs the renowned Hypertac hyperboloid contacts as the bedrock of its high reliability providing immunity to shock and vibration fretting and over 100,000 mating cycles. These features combine with current carrying capacity up to 1.5 Amps per contact and low insertion / extraction forces to provide significantly enhanced quality and reliability performance compared with other more commodity connector solutions. Available for direct mounting to PCB, the Nebula Series supports independent function for all its 22 contacts. It also offers optional quarter-turn locking hardware for faster connector securing and to prevent unintentional separation.

The HPC2812 is a rugged 6U VPX high-performance computer aligned with the compute-intensive SOSA profile, delivering top-tier processing with dual Intel® Xeon® D-2700 (Ice Lake-D) processors and flexible expansion capabilities. • Supports up to 128 GB DDR4 SDRAM with ECC and 480 GB NAND Flash (NVMe SSD) per node • Offers 2× 100 GbE (or 4× 40 GbE) data plane with RDMA, PCIe Gen 4 expansion plane, plus control and management plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security