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Seoul ADEX 2025 Digital Directory
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Some of our latest content
Companies, Products, News, Events
Korea Aerospace Industries
LAH
Contribute the Enhancement of Armed Forces with Continuous Technology Development Designed for replacing the Republic of Korea Army(RoKA)’s aged attack helicopter (500MD, AH-1S), the LAH(Light Armed Helicopter) Project is the one that aims to develop a cutting-edge armed helicopter suitable for the modern battlefield. Through the synergy of maximizing commonality in subsystems and parts with LCH(Light Civil Helicopter), KAI will reduce the development, production, and sustainment cost ultimately to be a bridgehead for a global helicopter market. The first flight of LAH was successfully conducted in 2019. KAI aims to complete the development of LAH in 2023.
ViscoTec Pumpen- u. Dosiertechnik GmbH
Edge Filling – Dosing of Edge Fillers
In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.
REDCOM Laboratories, Inc.
REDCOM Sigma® C2 Software
Designed to support U.S. DoD modernization strategies, REDCOM Sigma is a complete software-based Command & Control solution with voice, video, chat, and conferencing. REDCOM Sigma® increases the warfighter’s operational flexibility while reducing size, weight, and power (SWaP) requirements at the tactical edge. REDCOM Sigma is based on open standards with a focus on interoperability, flexibility, and ease of use, and is listed on the DoDIN Approved Products List (APL). REDCOM Sigma was selected by the U.S. Army’s Program Executive Office Command, Control Communications-Tactical for network modernization at the tactical edge. Sigma is being deployed to multiple programs within the U.S. Army at the battalion level and below.
Haynes International
Haynes Aero alloys
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Seoul ADEX 2025 Digital Directory
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In-depth Exhibitor Profiles
Each exhibitor can add as many products and services as they wish, with in-depth information and specifications. This allows buyers to find what they want easily.
Self Provisioning for Exhibitors
Each exhibitor has full control of their content - to edit their company profile, upload products and enter staff details.
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최신 콘텐츠
기업, 상품, 뉴스, 이벤트
BAE Systems
Intelligent Autonomous Systems R&D
Success in modern warfare requires technologies that use adaptive intelligence processing to help military personnel make better decisions faster and stay ahead of opponents at every stage of mission. That's what our Autonomy R&D teams excel at creating, and it's what our unparalleled autonomous solutions deliver on land, at sea, in the air, in space, and beyond.
FIBERPRO, Inc
Fiber Optic Gyroscope
- 1 axis Fiber Optic Gyroscope - Bias Repeatability (over temp. range): ≤ 1.0º /hr (1σ, RMS) - Angle Random Walk: 0.035º /√hr (typical, 1σ) - Power Consumption: 1.3 W @ 25℃ (<2.4 W, @ -40℃) - Input Voltage: + 5 V - Weight: 165 g (0.36 lbs)
RF Systems
Dip Brazing Technology
Brazing is bonding two or more pieces of metal by means of flowing a filler metal between the joint interfaces at a temperature below the melting point of the base metal. The filler metal, upon cooling to the solid state, forms a strong metallic bond throughout the joined area. Through Dip-Brazing, RF Systems manufacture 1. Brazed Antennas 2. Brazed Waveguides 3. Brazed Divider / Combiner
Sangdo Electronics co.,Ltd
HDLP
High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.
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