Cooled thermal imaging camera module F/#4.0 • Detector type: Cooled InSb 15μm (640 x 512) • NETD: <20mk typical (without lens) • Continuous ZOOM LENS • Continuous Digital Zoom • Advanced image processing - Auto Gain Control (AGC) ) - Adaptive Histogram Equalization (Adaptive HEQ) - Local Area Enhancement (LAE) - Digital Detail Enhancement (DDE) - Denoise Reduction (DNR) - Sharpness • MTTF (Mean Time To Failure) 15,000 hours • Various color sets (WhiteHot / Rainbow / Twilight / TwilightShifted / Turbo / Iron / Plasma)

MOHOC® and MOHOC® IR Cameras are purpose-built for tactical operations, offering rugged, reliable video capture designed specifically for military, law enforcement, and emergency response teams. Featuring a patented helmet-contoured base and low-profile design, these cameras eliminate snag hazards and maintain a secure, stable mount throughout dynamic missions. Both models record in crisp 1080p HD video and 12MP stills, with the MOHOC® IR version capable of capturing footage under infrared illumination—essential for night operations and low-visibility environments. A single-button interface with tactile vibration feedback ensures intuitive control, even when wearing gloves or in high-stress scenarios. Fully waterproof to 10 m and drop-resistant to 2 m, the MOHOC platform meets IP68 standards and is tested to MIL-STD-810G. Integrated features such as rotating lens, one-touch recording, and CurveLock™ mount system support rapid deployment and field adaptability. When used with C6ISR networks, MOHOC Cameras enable real-time video streaming and situational awareness at the tactical edge—empowering teams with the information needed to make mission-critical decisions.

STIM300 is a small, tactical grade, low weight, high performance non-GPS aided Inertial Measurement Unit. It contains 3 highly accurate MEMS gyros, 3 high stability accelerometers and 3 inclinometers. The IMU is factory calibrated and compensated over its entire operating temperature range. STIM300 is a cost-effective ITAR free solution for systems that only had FOGs as an alternative when reaching for the performance level of that STIM300 can offer. Each axis is factory calibrated for bias, sensitivity and compensated for temperature effects to provide high-accuracy measurements. The unit runs off a single +5V supply and communicates via a RS422 interface. The use of a 32-bit RISC ARM microcontroller provides flexibility in the configuration, like choice of output unit, sampling frequency, LP filter -3dB frequency and RS422 bit-rate and protocol parameters. For more advanced users, STIM277H may be put in Service Mode. In this mode all the configuration parameters can be temporarily or permanently changed by overwriting the current settings in the flash memory. Service Mode also provides the ability to perform single measurements, perform diagnostics and obtain a higher detail in the status byte.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

Powerful AI Capabilities On-prem LLM and RAG-based AI for fast and accurate information access Voice command support for hands-free control Optimized AR Technology VIRNECT View for AR visualization of work manuals VIRNECT Make for easy content creation and distribution

High impedance D-Sub connectors are designed to ground the outer shield of a twinax or quadrax contact directly to the shell of the connector. A multi-finger ground spring fixed around the shell provides a multi-point contact engagement that affords superior EMI shielding. The end result is an extremely low contact resistance when measured from the contact outer body to the connector flange, ensuring minimal RF noise and high durability of over 500 mating cycles.

High productivity • The nodding head type spindle maximizes productivity and efficiency during multi-face and 5-axis simultaneous machining operations. High rigidity • Dual ball screws deliver improved stability and responsiveness for heavy-duty cutting. Easy chip disposal • The machines’ central chip removal system improves operational efficiencies.

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.