The SBIR Training Program prepares business owners to write compelling SBIR/STTR grant applications with state-of-the-art proposal development workshops, structured mentoring, and follow-up guidance from proven business experts. SBIR (Small Business Innovation Research) and STTR (Small Business Technology Transfer) are highly competitive awards-based programs that finance small businesses hoping to commercialize their technology innovations.

· Optimized deployment of manned and unmanned aerial assets with separate takeoff and landing runways · Securing aerial/maritime superiority with unmanned combat aerial vehicles (UCAVs) and Drone · Expanded real-time surveillance range through the operation of medium-altitude unmanned reconnaissance aerial vehicles · Enhanced assault capabilities to target and command & control (C2) with manned and unmanned forces

Suite au Conseil du 7 octobre 2021, le GIFAS a accueilli Elixir Aircraft. Découvrez le témoignage de son Président. " Elixir Aircraft, entreprise rochelaise de 60 salariés, a été créé en 2015 afin de répondre aux enjeux de l'aviation légère : réaliser des appareils plus sûrs, plus économes et plus polyvalents .

OZVPX3-410 is Olzetek's flagship 3U product. Olzetek's 3U Platform Family has maximum scalability using Xilinx Zynq® UltraScale +MPSoC, which is capable of a high-performance Arm®-based multi-core and multi-processing system, as well as video signal/packet processing functions, graphics and video pipelines. This is a SoC product designed to meet challenging demands by offloading essential applications to dedicated processing blocks and supporting major peripherals and interfaces. The OZVPX3-410 product is an ideal solution that can be applied to applications requiring Analog Video (PAL/NTSC) encoding and decoding and includes customization options (consignment development) according to specific video inputs, requirements analysis, and design. We also provide consignment development of a complete Video 3U Platform.

Hyundai Elevator is leveraging its expertise in elevator technology to develop infrastructure for urban air mobility (UAM). We are working on takeoff, landing, charging, and maintenance platforms that can be built on top of existing buildings, solving space constraints in congested urban environments. Our initiative is backed by their manufacturing expertise and government support, though global building codes may present a challenge in scaling the solution.

Threaded bushing enables localized reinforcement of and attachment to panel structure. Supplied with disposable installation fixture. 1.25" Flange Diameter. SIZES: Imperial fine thread sizes from 10-32 (.190"-32) to 3/8-24 (.375"-24), Imperial coarse thread sizes from 8-32 (.164"-32) to 3/8-16 (.375"-16), and metric thread sizes from M5 to M8. 1.25" Flange Diameter. Grip lengths from 0.25" to 1.50". MATERIALS: Aluminum, 300 Series Stainless Steel, A-286 Stainless Steel, 316 Stainless Steel, and Titanium. Optional epoxy primer. FEATURES: Standard 1.25" diameter flange, 0.75" x 1.25" trimmed flange optional.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.

The TAC-450 FOG offers exceptional performance in bias stability, scale factor, and angle random walk, and is available in nine configurations to solve the most challenging design projects. The TAC-450 FOG is ideal for air, land, or maritime stabilization and pointing applications. Due to its versatility, and accurate, reliable output, it can also be utilized in navigation, guidance, and control systems. Highlights Designed for maximum ease of integration with housed or unhoused (for OEM configurations) options Available in nine configurations to solve the most challenging design projects Exceptional performance in bias stability, scale factor, and angle random walk 1-, 2-, or 3-axis configuration, each employing the world’s smallest precision FOG Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.