Metal braided sleeving and tubular expandable braided cable shielding is used primarily in the electrical wire interconnect industry to protect cables from electrostatic and electromagnetic interference. The interwoven conductive wire acts as a ground-path barrier that attenuates cable electrical field interference. In addition, both metallic and non-metallic braided shielding provides abrasion and cut protection for critical wiring, a particular concern in environments, such as aircraft, where vibration or other forms of rough handling may result in damage to individual wire conductors and cable bundles. Glenair manufactures the world's most innovative line of metal, monofilament non-metallic, and microfilament composite and stainless steel braiding solutions for environmental, mechanical, and EMC shielding in interconnect cable assemblies. Our industry-leading ArmorLite braided shielding is manufactured from ultra-lightweight stainless steel microfilaments, metal-clad for optimal conductivity and EMI/RFI shielding. Our AmberStrand tubular braided shielding is built from a lightweight composite thermoplastic microfilament, with or without additional metal filaments and plated for outstanding grounding and shielding protection. From high-temperature fiberglass tubular shielding for engine applications to ultra-lightweight EMI/RFI braided shielding for electrical wire interconnect grounding applications, Glenair offers the industry's most innovative range of solutions.

Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

Development of an integrated support system for total life cycle management of weapon systems

ENGINeUS™ Aircraft Electric Motors are self-contained direct drive propulsion power pods. This modular and scalable machine allows an easy integration into a vehicle whilst maintaining optimization of the propulsive function of new mobility platforms and hybrid turbomachinery.

Revolutionary DFOG Technology Boreas takes Fibre Optic Gyroscope (FOG) technology into the next generation with new, patent-pending Digital FOG (DFOG) technology, developed over 25 years with 2 research institutions. This revolutionary DFOG technology combines a specially designed closed-loop optical coil with advanced spread spectrum digital modulation techniques that have never been used in a FOG before. The resulting DFOG offers dramatically improved accuracy, stability, and reliability with significantly reduced size, weight, power, and cost.

ㅇ Key Features - Extremely compact, Lightweight - Automatic configuration upload - High speed internal / External digital bus - Support variety topology ( Star, Daisy chain) - Support 10/100/1000 Base T Ethernet - Missile, Fighter aircraft, UAV and Civil aircraft application ㅇ Quality and Certification - MIL STD 810G - MIL-STD-461F

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

Model-Based Systems Engineering (MBSE) is a methodology that integrates design, analysis, and verification activities throughout the system lifecycle using architecture models. By modeling requirements, functions, structure, and behavior, MBSE supports consistent and informed decision-making. Ansys SAM (System Architecture Modeler) supports the latest system modeling language, SysML v2, and enables both graphical and textual modeling, real-time collaboration, and model management. Ansys ModelCenter integrates various engineering tools and builds automated workflows, enabling what-if simulations and trade studies. By connecting architecture models with simulation models, it supports consistent design analysis and requirements validation using a single source of truth (ASoT).