The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.

The iGRVT-50 is InterGravity Technologies’ next-generation green-propellant orbital transfer vehicle (OTV), purpose-built for the rideshare launch ecosystem. iGRVT-50 enables small payloads (up to 15–20 kg class) to be deployed or serviced in a wide range of orbits. Key Features - Payload Capacity : Up to ~20 kg class hosted payloads - Propulsion System : 20 N green bipropellant thrusters (C₂H₆/N₂O) - Delta-V Capability : > 450 m/s - Communications : UHF, S-band TM/TC, X-band downlink

The VPX6-C6 which provides a full 6U OpenVPX(VITA65) is a Single Board Computer(SBC) that combines the power, versatility, cost-effectiveness of the 8th generation Intel mobile one-chip processor solution with the reliability. VPX6-C6 is based on the Intel i7-8665UE CPU that has quad cores running at 1.7GHz and providing a 32Gbytes of highbandwidth DDR4 SDRAM. Intel i7 processor includes an integrated Intel UHD 620 graphics engine, providing discrete GPU performance with OpenGL for graphics-intensive applications. For storage application VPX6-C6 provides the built-in 80GB SLC NVMe SSD solution via PCIe x4 lanes as well as the external SATA expansion through VPX site. The VPX6-C6 satisfies the demanding applications ranging from tactical aircraft to armoured vehicles to rugged industrial systems, with its rich complement of features and I/O including Intel Graphics, Integrated Platform Management Interface, Gigabit Ethernet, DIO, Serial channels, USB ports and more.

Integrated Soldier Power / Data Hubs are Personal Area Network (PAN) hub and interconnect systems providing network data access, peripheral connectivity and smart battery power management for dismounted soldier C4ISR electronics in Digitally Aided Close Air Support (DACAS) missions, including precision targeting, tactical radio communications, real-time video downlink, night vision technologies, GPS/navigation, blue force tracking, personal computing and smart phone integration.

"It is a product lineup that is proven in global markets and has world-class competitiveness. And it is being exported to more than 20 countries around the world."

< Frequency Range > ● LB-400: 400 ~ 460MHz ● LB-900: 800~928MHz ● MB-1500: 1300~1500MHz ● MB-2400: 2400 ~ 2500MHz ● HB-5.2: 5150 ~ 5250MHz ● HB-5.8: 5725 ~ 5875MHz < TX path output Power (at antenna port) > ● Normal mode: 35dBm [min] ● On each antenna port 2x 35dBm ● Interference mode: 40dBm [min] < TX path maximum Input Power > ● +20 dBm < RX path Gain > ● 25dB typ. < RX path Noise figure > ● Low bands: 3dB max. ● High bands 3.5dB max. < RX path IIP3 > ● -10dBm typ. < RX IP1dB compression point > ● 15dBm typ. < Power Supply > ● +24V ± 1 Vdc

Main Features of CLS-30T5 Camera Link Compatibility: Supports all Camera Link types (Area Scan / Line Scan). Video Distribution: 1:5 distribution capability supporting Base, Medium, and Full configurations. Power over Camera Link (PoCL): Performs PoCL Bypass functionality. Pixel Frequency: Supports a pixel frequency range of 20 MHz to 85 MHz. Transmission Quality: Ensures lossless video signal transmission. Power Connector: Equipped with a lockable DC power jack (Molex connector). Interface: Supports MDR-26 type connectors. Control Signal Support: Supports all standard RS-232 communication speeds.

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.