High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

InspecX is a next-generation autonomous swarm inspection system for aircraft. It is addressing challenges in the $100B global aviation maintenance market. Airlines face a shortage of certified technicians, with Boeing projecting demand for over 700,000 by 2044. Aircraft-on-ground (AOG) incidents cost $10,000–$150,000 per hour, making downtime reduction critical. InspecX uses swarm coordination and LiDAR-based SLAM to perform safe inspections in GNSS-denied or indoor environments. It reduces required technicians from 9 to 3 and inspection time from 10 hours to 3, achieving over 50% cost savings for large aircraft. Beyond efficiency, InspecX helps airlines avoid AOG losses, accelerates maintenance cycles, and improves airworthiness. By maximizing fleet readiness and ensuring reliable operations, it provides a scalable, future-proof solution. InspecX is positioned to become the new global standard for aviation safety and maintenance in the era of intelligent mobility.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.

Amphenol RF is the world's largest manufacturer of coaxial connectors used in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing, and manufacturing facilities in North America, Asia, and Europe. Its connectors, adapters, cable assemblies, and other RF and microwave solutions are widely used in a wide range of industries and applications, including automotive, broadband broadcasting, instrumentation, medical, and defense wireless equipment. Amphenol RF's industry-leading manufacturing technology and process control enable it to produce high-quality coaxial connectors and cable assemblies at high volumes.

Device for checking turret operation, turret fan control, air conditioning control, and status.

Magnetic sensors (Hall effect) for air and land applications fly by wire

1. Ultra-high Performance LED Searchlight (53,000lm+ max) - Designed with heat sink optimization via thermal analysis for extended illumination. 2. Powerful Broadcasting System (100dB) 3. AI Algorithm for Automatic Object Recognition and Tracking based on Jetson Platform 4. Equipped with EO/IR Cameras for All-Weather Surveillance and Precise Target Identification 5. Hybrid Wired/Wireless System for Enhanced Flight Endurance: Wired Power System, Automatic Wired Detachment Module