AuraGen® ... Unlike a traditional generator, this induction power system fits under the hood of a vehicle and can generate enough pure sine wave electricity to handle your power needs. The AuraGen's safety, reliability, portability, virtually silent operation, and convenience make it ideal for use during everyday commercial work or anywhere that conventional power is absent. No maintenance, no theft problems and no hazard for employees means higher productivity and higher profits. The AuraGen® comes complete with the AuraGen® power source, electronics, idle control, and mounting bracket and provides an environmentally friendly alternative to heavy polluting gensets. AuraGen® is available for most fleets, municipal and work site vehicles as well as full-sized pickups and SUV's.

Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

Leveraging industry’s leading MEMS technology to provide previously unheard of capabilities in angle random walk values (0.02°/√hr.) without loss of tactical grade levels across military environments, including 1°/hr. bias stability, the SDI500 is designed to achieve the demanding performance levels required in sophisticated systems applications. It is particularly suited for use by Integrators and OEMs, packaged in a highly miniaturized, cylindrical configuration with a volume of only 19 cubic inches. Boasting a 20-Year lifetime capability without requiring calibration and a MTBF of more than 100,000 hours, multiple output data formats and SDLC, RS232 and UART output interfaces are provided in this revolutionary IMU for optimized systems protocols.

HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.With a 0.6mm contact diameter, the HPH Series comes in 3-6 row configurations and is available up to 303 signal contacts on a 1.901mm staggered grid. Contacts are removable for ease of maintenance.

AMD builds on its 30+ years of continuous focus and heritage in Aerospace and Defense, extending the XQ defense-grade portfolio with AMD Versal XQ Series SoCs. Versal adaptive SoCs combine adaptable processing of the programmable logic and acceleration engines with leading-edge memory and interfacing technologies to deliver customized, powerful heterogeneous acceleration for any application.

With durable constructions, GORE-FLIGHT Microwave Assemblies provide reliable performance for critical aircraft systems. To improve signal integrity and reduce interference, they incorporate shielding that meets and even exceeds the 90 dB requirement. A consistent impedance of 50 ± 1 ohms ensures a lower insertion loss and more reliable VSWR than leading competitors, both before and after installation. GORE-FLIGHT Microwave Assemblies also deliver the following benefits: Durability for the Life of the System Cost-Saving Performance

HyperStac RX Series is a Z axis interconnection solution designed for all types of micro-electronics applications requiring reliable and compact packaging solutions. The Hyperstac RX Series meets the needs of the Defence, Avionics and Space electronics applications.

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