The COX640AV embodies COX’s cutting-edge cooled MWIR imaging technology, delivering unparalleled performance for the most demanding applications. Its 640x512 resolution and 15μm pixel pitch InSb sensor achieve thermal sensitivity of less than 20mK, ensuring crystal-clear imaging for precise analysis. Capable of operating across a wide temperature range, the COX640AV supports multiple imaging modes and advanced processing functions including AGC, NUC, and customizable color palettes. This ensures adaptability to a variety of mission-critical environments such as defense, aerospace, scientific research, and industrial inspection. In addition to superior imaging quality, the COX640AV is designed for reliability and operational readiness. With rapid image stabilization after startup and robust construction, it performs consistently in harsh environments where stability is non-negotiable. Its combination of cooled MWIR precision, advanced processing features, and rugged design positions the COX640AV as a trusted solution for customers who require accuracy, speed, and durability. By integrating COX’s proprietary calibration expertise, it not only provides outstanding real-time imaging but also guarantees long-term reliability and service continuity.

SungJin's Board to Board Connector(SJB) is a 2mm pitch D-SUB connector. The SJB has been developed for the aerospace, avionics, instrumentation & control, defence and transportation markets, with applications that include flight controls, radars, missiles, electro-optical sighting systems, satellites, mobile radios, ower supplies and engine controls. It is also used in a growing number of medical, and telecom applications. SungJin's Board to Board Connector(SJB) are designed to meet or exceed the relevant electrical and environmental performances described in MIL-DTL-55302F standards.

External SSD drive with total data delete option by hotkey or red button push Highly robust solution due to the use of a full-aluminium chassis Highly customizable Native supported four inputs for Full HD SDI cameras

BERNIER designed the CMASD line specially for harsh environments. This line presents the same apreciated characteristics than the CMA connectors in a smaller shell in which can be set up to 8 contacts. Its ergonomics and toughness enhances headsets and handsets use and its construction allows high speed data communication. . Applications RADIOS – ACCESSORIES – INTERCOMS – CRYPTED DATA – OPTRONIC DEVICES – WEAPON SYSTEMS – RUGGED COMPUTERS – TACTICAL EQUIPEMENTS

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

The Arizona Aerospace & Defense Supply Chain Directory is a comprehensive, interactive database designed to connect A&D companies with Arizona-based suppliers. The database includes detailed profiles of more than 1,250 companies with a presence in Arizona, and allows users to search by industry, size, certifications and products and services offered.

A compact EO/IR gimbal camera system designed for UAVs, unmanned surface vehicles, and defense platforms. The system integrates a QVGA/VGA-class LWIR thermal imager and a high-resolution EO camera within a stabilized gimbal, ensuring reliable performance in diverse environmental conditions. Optimized for ISR (Intelligence, Surveillance, Reconnaissance) missions, the system provides detection, recognition, and identification (DRI) capabilities with low-SWaP (Size, Weight, and Power) characteristics.

A lightweight high tensile aluminium frame, suspended by elastomeric anti-vibration mounts, provides superior ‘sway-space’ between the frame and the outer container and is the best possible way to safeguard delicate equipmentMore robust and stainless steel variants are custom-made for heavy payloads and corrosive environments. Enhanced ‘sway space’ between inner frame and outer case to prevent contact with outer container All our 19 inch Amazon Racks have a ‘user adjustable’ inner frame allowing back to front movement of 50mm within the outer container to accommodate front panel and rear wiring/ connector needs. Optional ‘EasyGlide’ removable, self anchoring, internal frame system Standard, stainless steel M6 threaded fasteners secure electronic equipment into floating stainless steel cage nuts at both front and rear of frame. All our 19 inch Amazon Racks have positive stacking, aligning at the front face regardless of rack depth