Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.

Air travelers will have temperatures checked quickly with technology As more people receive COVID-19 vaccines, travelers are itching to visit friends and family and take vacations again. Here's how airlines in one major U.S. airport will help keep passengers safe.

Magnetic sensors (Hall effect) for air and land applications fly by wire

Our transport drone is designed for efficient and reliable cargo delivery. With precise and stable flight performance, it supports real-time monitoring of delivery routes and environments through an advanced camera system, ensuring safe and timely operations.

ts advanced integrated optics and closed-loop Field Programmable Gate Array (FPGA) electronics deliver much higher accuracy, lower noise and greater efficiency than competing technologies. In addition, the EG-1300 can be calibrated internally for better thermal effect and has both digital and analog outputs, along with separation of the electronics from the FOG’s sensing coil assembly to accommodate the widest variety of installation parameters. Features Fully-integrated optics and electronics Advanced optics and FPGA electronics for higher accuracy, lower noise and greater efficiency Precise navigation (1 mile/hour without GPS) Fast, precise gyrocompassing to 1 milliradian Bandwidth to 500 Hz Separate electronics and sensor modules More economical than competing systems Applications Navigational grade applications Unmanned aerial vehicle (UAV) guidance Missile guidance Aeronautics and aviation Robotics

As domains converge and connect, new threats and opportunities emerge. By giving our service members every advantage for operational success, we create a safer world. It is this mission that drives our relentless innovation in defense technology. With our integrated expertise and capabilities, Raytheon Technologies is uniquely positioned to give our customers the advantage in every moment.

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SEMIL-2000GC is an extreme-rugged IP69K dustproof and waterproof edge AI platform in a 2U 19" rack-mount form factor. SEMIL- 2000GC incorporates Neousys' best-in-class thermal design to ensure fanless maximum GPU performance in wide range -40°C to 70°C temperatures. The system is also integrated with an NVIDIA® L4 GPU that offers up to 2.5 times the performance over Tesla T4.