High impedance D-Sub connectors are designed to ground the outer shield of a twinax or quadrax contact directly to the shell of the connector. A multi-finger ground spring fixed around the shell provides a multi-point contact engagement that affords superior EMI shielding. The end result is an extremely low contact resistance when measured from the contact outer body to the connector flange, ensuring minimal RF noise and high durability of over 500 mating cycles.

C-UAS and Advanced Threats 70kW CBC HEL Source

If it’s on our schedule, you’re invited. As an exhibitor in the Partnership Pavilion, in addition to official show events you also have exclusive access to official Pavilion events. Exhibitors benefit from exclusive access to the Partnership Pavilion events, including the official Pavilion Opening Ceremony and Ribbon-Cutting, off and on-site hospitality receptions, networking events, business and market insight briefings, and topical industry presentations.

Psion designs and manufactures high-performance NVIS-compatible LEDs, supporting a wide range of applications in defense and aerospace industries. Our lineup includes Green A, Green B, Red, Yellow, Covert, White, as well as white- and black-frame LEDs — all developed to meet MIL-STD-3009 requirements. We specialize in customized solutions, offering flexible options in wavelength, color, size, and optical characteristics to meet diverse customer specifications. With several years of R&D experience and ongoing deliveries to global clients, Psion is actively shaping the future of the NVIS LED market through innovation and precision engineering.

Digital mission engineering tools connect every stage of the engineering product lifecycle, from initial design to operation. They enable reality-based 3D simulation across multi-domain environments such as air, space, land, and sea by incorporating high-resolution terrain, satellite orbits, RF and radar systems, and sensor environments to accurately replicate real mission conditions. With accurate dynamics-based physical models at the core, these tools provide quantitative analysis of relative positioning between systems, changes in altitude and attitude, line-of-sight availability, and communication link status. Users can predict and evaluate mission elements such as sensor operations, communication links, platform maneuvers, and orbit optimization through scenario-based simulations.

Processor - NXP Quad Core PowerPC QorIQT2080 up to 1.8GHz - 6 DMIPS/MHz per core (up to 43,200 DMIPS@1.8GHz) - 128b AltiVecSIMD unit (up to 72 GFLOPs@1.8GHz) Memory - 4GB soldered 64-bit DDR3L SDRAM with ECC - 256MB 16-bit NOR flash - 64GB SATA NAND SSD - 512KB NvRAM Form Factor - 3U OpenVPX - Conduction-Cooled

specialized heat shrink tubing for the defense industry, with international standards such as QPL SAE AS23053, DEF STAN 59-97, VG 95343, and BS G198.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.