Our electronics business sector has been producing copper cladded laminates of printed circuit boards for over 20 years. To meet high heat dissipation for the newest electronic technology, we have developed metal based laminates and carbon laminates.

Ray Service, headquartered in Staré Město, Czech Republic, is an international innovative manufacturer of cable harnesses, electromechanical assemblies, and electronic equipment. It is also a distributor and integrator of cable components and system products. More than 30 years of experience and intensive development have resulted in a strong, modern enterprise, a reliable and sought-after partner on an international level.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

- Form factor: 6U VME64x - Processor: Intel® E3-1505Lv6 2.2GHz 4 Cores and 8 Threads - Memory: 16,000MB DDR4 SDRAM w/ECC, (1) 73GB up NVMe SSD

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

1. Machining • Small, medium, and long bed machining available, with sizes up to 20 meters • Precision 5-axis machinery supporting 4m, 6m, 8m, and 20m machining beds. • Capable of machining both hard and soft metals 2. Sheet Metal Fabrication • Roll forming (11m), skin stretch forming (10m) • Bladder and stretch wrap forming • Skin milling & NC routing 3. Composite • Specialized Curing Oven up to 15M • Layup Facility 4. In-house Heat Treatment Facility (NADCAP Accredited) Highlights √ Proven Korea Defense Offset Partner for Global OEM √ Integrated Global Program Operation in Korea and USA Facilities √ Boeing & Lockheed Martin Award Winning Supplier Project Highlight : • A32X/A330 Skin Structure, Floorgrid, Doors • KT-100 Full aircraft Integration • Helicopter Fuselage, Torque Box, Bulkhead, Leading Edge etc.

R&S®M3SR은 민간, 방위, 해상 지-공-지 통신 솔루션을 위한 최신 고정식 무전기를 대표하는 기기입니다. 로데슈바르즈는 점차 엄격해지는 통신 요구사항에 대해 수년 간의 실무 경험을 기반으로 한 기술 개념으로 대응하고 있습니다. 무전기는 가장 엄격한 품질 측면을 충족하여 최대 RF 성능을 제공합니다. 이 고성능 소프트웨어 정의 무전기는 전 세계 보안 당국과 정부 조직에서 높은 평가를 받고 있습니다.