BERNIER designed the CMASD line specially for harsh environments. This line presents the same apreciated characteristics than the CMA connectors in a smaller shell in which can be set up to 8 contacts. Its ergonomics and toughness enhances headsets and handsets use and its construction allows high speed data communication. . Applications RADIOS – ACCESSORIES – INTERCOMS – CRYPTED DATA – OPTRONIC DEVICES – WEAPON SYSTEMS – RUGGED COMPUTERS – TACTICAL EQUIPEMENTS

This EGR-Cooler prototype, developed in collaboration with Hyundai Motor Company, was fabricated using EOS Stainless Steel 316L, renowned for its excellent corrosion resistance and mechanical properties in demanding automotive applications. The part was additively manufactured over a period of 64 hours, demonstrating the advanced capabilities of metal 3D printing for precision and reliability. Unlike conventional designs, this innovative component integrates 14 separate parts into a single, unified structure, greatly simplifying assembly while enhancing operational efficiency. The implementation of a Triply Periodic Minimal Surface (TPMS) structure within the cooler significantly improves heat exchange performance and enables substantial weight reduction, meeting next-generation thermal management requirements. Partners Lab stands as a leader in Korean additive manufacturing technology, offering cutting-edge capabilities in OEM production and collaborative technical development for various industrial sectors. This EGR-Cooler, designed by nTopology, exemplifies our engineering expertise and commitment to delivering high-performance thermal products for automotive and beyond.

Our products include brake clips and brackets.

Monitors abnormal engine operation based on digital and analog signals from the aircraft engine. It calculates engine life indices and detects engine malfunctions for generate a Pilot Fault List (PFL), which will stored in memory. When an engine failure is detected, it provides warning for display on the Central Maintenance Panel (CMP). Developed as a replacement for obsolete, achieving 60% cost competitiveness compared to equivalent products. - x1 MIL-STD-1553B - x16 Discrete Inout - x14 Discrete Output - x3 Analog Input - x1 RS-232 - Size: 283 x 265 x 89 (mm) - Weight : 4.1Kg - Environment : MIL-STD-810G - EMI/EMC : MIL-STD-461G - Power : MIL-STD-704F (28VDC, 25W)

In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

The MAGIC1A is a rugged 3U VPX SWaP-C3 high-performance embedded computer combining an Intel Xeon E3-1505M v6 CPU and NVIDIA Quadro P2000 GPU, offering strong compute performance, broad I/O, rugged resilience, and flexible software support. • Xeon E3-1505M v6 quad-core CPU + Quadro P2000 GPU → ~2.3 TFLOPS • Ethernet, USB, serial, MIL-STD-1553, ARINC 429, DisplayPort/DVI, GPIO; up to 8 TB removable SSD with fast-purge • MIL-STD rated, baseplate or fan cooling; −40 °C to +65 °C range • Supports Linux/Windows/VxWorks & CUDA/OpenCL/DirectX/OpenGL; includes AXIS software toolkit

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.