For : Nose-Landing Gear Assembly Jig A350 Project 4.8m (L) x 2.5m (W) x 3m (H )

ORSKOREA’s centerless grinding machines ensure stable accuracy and durability without the need for chucks or centers. By allowing workpieces to rotate freely between the grinding and regulating wheels, they deliver high-efficiency and uniform machining for shafts, pins, housings, and other cylindrical components used in aerospace, defense, and advanced automotive systems. Key Advantages • High productivity through fast, efficient multi-part processing • ±2μm precision and long-term repeatability • Versatility to handle components from small to large sizes • Hydrostatic slides and spindles minimizing heat and vibration • Proven stability for high-value part manufacturing such as engine components, battery cases, and optical housings By combining productivity, accuracy, and reliability, ORSKOREA’s centerless grinders significantly enhance competitiveness in both defense and civilian applications.

Key Features - Frequency Range: 8.5 - 10GHz - RX Noise Figure: 3.0dB - RX Small Signal Gain: 21 dB - TX Small Signal Gain: 27dB - TX High Pout: 39dBm - TX High PAE: 37% Chip size: 2.9x2.5x0.1mm  

Our PIT systems are built to withstand the toughest weather conditions and meet international aviation standards. Our versatile configurations are tailored to your operational needs - from compact access units to advanced pop-up mechanisms. PIT system types: MINIPIT Hatch Systems – Compact and simple underground solution for smaller aprons or light traffic zones. Standard Hatch PIT Systems – Durable and reliable access pits for electrical, fuel, and IT systems under the apron. Pop-Up PIT Systems – Mechanized lifting PIT system for convenient and fast surface access when needed. Each system offers specific advantages depending on the scale, type of aircraft, and regional standards of your operations.

The Defence Technological and Industrial Bases is indispensable for maintaining peace and security. After all, it provides an armed force with services and equipment. If it does not, the armed forces are left hobbled. This also applies to the Dutch armed forces. Nevertheless, the defence and security sector is experiencing difficulties in accessing private finance. Referring to Environmental, Social and Governance (ESG) criteria, companies in the sector would not be able to access private financing from pension institutions, insurers and financial service providers. Because of the same criteria, the sector is experiencing difficulties in opening accounts with private banks. Below is summary on the current state of the issue.

The SWE450S is a rugged 3U VPX fully managed Layer-2/3 Ethernet switch aligned with the compute-intensive SOSA profile, delivering high-performance 25/100 GbE switching and flexible I/O reconfiguration. • High-performance 2 Tbps switch fabric with wire-speed throughput • Front: up to 2x 100 GBASE-SR4 (MPO); Rear: 25/100 GbE KR4, 100/1000 BASE-T, USB-C, RS-232Reconfigurable fat-pipe to thin-pipe ports, speed downgrading capability • Dual-core ARM + OpenWare™ management, sanitization support • SOSA-aligned (SLT3), rugged air- & conduction-cooled options

The SDT F 16 Combat Training Pod is mounted on F-16 and similar air platforms in an external pod, and ensures efficiency in exercises and in the provision of air-to-air and air-to-ground tactics training to pilots. SDT F - 16 Combat Training Pod features advanced air-to-air and air-to-ground combat training capabilities, such as real-time autonomous position generation, weapon simulation and real-time hit/miss notification, thanks to its long-range and high-speed RF data link and integrated processors. The system has mission planning, live monitoring, debriefing and analysis/evaluation features. The SDT F 16 Combat Training Pod enables training in real flight conditions and in multi-threat/target environments. Its high-speed data link and modular design mean that the System is also a Live-Virtual-Constructive (LVC) training infrastructure.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.