Plane Windows are used as substrates for a variety of applications, such as laser window, output couplers, beamsplitters, beam combiners, mirrors, dichroic filters and plate polarizers. Considerations in selecting window substrates include transmission range, absorption coefficient, incident laser power density and environmental factors such as pressure, temperature, moisture, abrasion and corrosion. Plane Windows listed under UV / VIS / NIR substrates are specified for applications involving coating wavelengths 193nm ≤ λ〈2.0 μm. Units for these substrates are given in mm. Plane Windows listed under IR substrates are specified for applications involving coating wavelengths λ≥ 2.0 μm. Units for these substrates are given in inches. Refer to the THIN FILM COATINGS section for information on coatings that can be applied to these substrates.

The TAC-450 FOG offers exceptional performance in bias stability, scale factor, and angle random walk, and is available in nine configurations to solve the most challenging design projects. The TAC-450 FOG is ideal for air, land, or maritime stabilization and pointing applications. Due to its versatility, and accurate, reliable output, it can also be utilized in navigation, guidance, and control systems. Highlights Designed for maximum ease of integration with housed or unhoused (for OEM configurations) options Available in nine configurations to solve the most challenging design projects Exceptional performance in bias stability, scale factor, and angle random walk 1-, 2-, or 3-axis configuration, each employing the world’s smallest precision FOG Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

AR-Powered Work Manuals: Overlay step-by-step instructions onto real-world environments for precise execution. Seamless Integration: Compatible with VIRNECT Make, allowing easy creation and distribution of AR content. Remote Collaboration: Connect with experts via VIRNECT Remote for live support and guidance. Multi-Device Support: Available on Windows, Android, and iOS, ensuring flexibility across various platforms.

Aircraft usage optimization is a key factor for all airlines. Safran Engineering Services helps major aircraft manufacturers perform and optimize the service level offered to the airlines. Flight operation activities are performed in France, Spain and India with global coordination.

QPL certification is a system in which the US government guarantees the quality only for products that have passed strict local company inspections made of 150 tests and verifications under the supervision of the US government. Yeonhab Precision obtained the certification in Asia for the first time after 10 years of application. In particular, with the successful QPL registration for the first time in Asia, Yeonhab Precision is the first and only company in Asia which got the qualification of marking “MS” with the title of “Korea’s first MIL-DTL connector”. We will provide customers with the best products as we have the sense of the pride of developing the QPL certified connector with our own technology in Korea.

- Seamless integration with all CAD models - Specialized for UAM and eVTOL design - Supports analysis of complex aerodynamic phenomena - Accurate prediction of airflow under subsonic and supersonic flight conditions - Detailed analysis of boundary-layer flow separation and viscous effects