With advanced 3D printing, our turbine blades redefine manufacturing—delivering faster development, higher efficiency through superior quality, and innovative design freedom.

Designed on MPS Microsystems’ modular optomechanics platform, the High-Speed Coaxial Lens Actuator delivers custom-engineered, micron-level alignment in a footprint of just 170 × 87 × 45 mm. Two brushless motors drive lens holders (Ø 12.7 mm) that move in the same precision-machined bore, guaranteeing perfect coaxiality throughout the 3.75 mm stroke and no shimming or iterative alignment required. The closed-loop cam mechanism runs friction-free, ensuring a maintenance-free stage that can be used in laser machining heads, spectrometers or 3-D scanners and keeps working for millions of cycles. Most importantly, stroke, motor, encoder and mounting interfaces of this high-speed coaxial lens actuator can all be customized to fit your needs with regards to optical and space constraints.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

CI Systems사의 는 구성 가능한 소형 휴대용 미사일 방사 시뮬레이션 플랫폼입니다. MSS는 항공기 이륙 라인에서 정기 검사로 또는 실험실에서 미사일 경보 시스템(MWS)의 준비 상태와 성능을 테스트할 수 있도록 합니다. MSS는 자외선(UV) 또는 적외선(IR) 대역의 소형 방사 소스를 내장하고 있으며, 단일 또는 이중 방사 소스를 지원합니다. 이 소스는 내장된 마이크로프로세서에 의해 모드 조절되어 어떤 미사일이 방출하는 방사라도 현실적인 시뮬레이션을 제공할 수 있습니다. 사용자 친화적인 소프트웨어를 통해 어떤 테스트 프로파일도 MSS에 구성하고 업로드할 수 있습니다. Translated with DeepL.com (free version)CI Systems’ Missile Signal Simulator (MSS) is a configurable compact, hand-held, missile radiation simulation platform. The MSS enables the operator to test the readiness and performance of Missile Warning Systems (MWS) in the flight line as a routine test and in the laboratory. The MSS contains a miniature radiation source in the UV or IR band, with single or dual radiation sources. They are modulated by a built-in microprocessor capable of delivering a realistic simulation of the radiation emitted by any missile. Any testing profile can be configured and uploaded onto the MSS using a user-friendly software.

The single-board computer developed by Coats Technology is a core component that implements the performance of weapon systems and satisfies high reliability under environmental conditions such as temperature, vibration, shock, and EMI. It also performs data processing, integration and control of various onboard equipment through data buses, and communication functions to automate command and control, communication, computing, and information elements.

The beginning of national defense and security, it has been recognized for its reliability and stability. VITZROCELL's Military batteries meet stringent military performance requirements and are applied in defense systems and smart weapons.

Its compact and robust design, coupled with a choice of analog, digital, and digital RS-232 outputs, makes the DSP-3000 the most versatile fiber optic gyro available and an ideal solution for guidance and stabilization, low-cost IMUs, integrated GPS/INS, and AHRS. Highlights EMCORE’s mature all-fiber optical circuit for exceptionally low noise (ARW) EMCORE’s proprietary E•Core polarization-maintaining fiber Robust, modular design housed in a package roughly the same size as a deck of playing cards Technology Details DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design is covered by multiple patents* and overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. *This product is covered by one or more patents, including U.S. Patent #6,429,939, “DSP Signal Processing for Open Loop Fiber Optic Sensors.” Feature Options Two Versatile Variants If you need a compact FOG with a powerful high-speed RS-422 interface with 1000 Hz asynchronous output, consider the DSP-3100 FOG. If you require a true RS-422 interface and a 1000 Hz synchronous output in a durable, shielded package, take a look at the DSP-3400.