A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

Ray Service, headquartered in Staré Město, Czech Republic, is an international innovative manufacturer of cable harnesses, electromechanical assemblies, and electronic equipment. It is also a distributor and integrator of cable components and system products. More than 30 years of experience and intensive development have resulted in a strong, modern enterprise, a reliable and sought-after partner on an international level.

The S10s, the first model of the PabloM series, is a loitering munition designed for strike missions. Leveraging mesh communication and AI-enabled swarm flight, it can execute both simultaneous and sequential self-destructive strikes against targets, effectively neutralizing diverse “anti-drone” systems. The S10s launches autonomously from a dedicated platform and can sustain flight for over 30 minutes, enabling wide-area operational coverage. When engaging a target, it performs a steep dive of up to 45 degrees at speeds reaching 150 km/h, ensuring rapid and precise impact. Built from lightweight foam-board materials, the S10s is optimized for fast, large-scale production during operations. Furthermore, its modular open-architecture design, aligned with the K-MOSA concept, allows mission payloads to be quickly swapped and integrated, delivering exceptional flexibility and interoperability in real combat environments.

INCOLOY® Alloy A-286 -Bars-Sheets and Plates Material no. 1.4545.4 / 15-5PH -Bars Material no. 1.4548.4 / 17-4 PH -Bars Material no. 1.4546.9 -Bars

ORSKOREA’s centerless grinding machines ensure stable accuracy and durability without the need for chucks or centers. By allowing workpieces to rotate freely between the grinding and regulating wheels, they deliver high-efficiency and uniform machining for shafts, pins, housings, and other cylindrical components used in aerospace, defense, and advanced automotive systems. Key Advantages • High productivity through fast, efficient multi-part processing • ±2μm precision and long-term repeatability • Versatility to handle components from small to large sizes • Hydrostatic slides and spindles minimizing heat and vibration • Proven stability for high-value part manufacturing such as engine components, battery cases, and optical housings By combining productivity, accuracy, and reliability, ORSKOREA’s centerless grinders significantly enhance competitiveness in both defense and civilian applications.

Powered by NVIDIA® Jetson AGX Orin™ SoM bundled with JetPack 5.1.1 Powered by NVIDIA® Jetson AGX Orin™ Industrial bundled with JetPack 6.0 Rugged -25°C to 70°C fanless operation (JAO32/ JAO64) - No throttling at 55°C with JAO64 MAXN Mode Rugged -40°C to 75°C fanless operation (JAOi) - No throttling at 50°C with JAOi MAXN Mode IP66 waterproof and dustproof Support 8x GMSL2 automotive cameras via FAKRA Z connectors (NRU-230V-AWP) 4x PoE+ GbE and 1x 10GBASE-T via M12 X-coded connectors 2x isolated CAN 2.0, 1x RS232, and 1x isolated RS485 via M12 A-coded connectors 1x system monitoring port by automotive-grade MCU 8V to 48V wide-range DC input with built-in ignition power control Compatible GMSL2 cameras with pre-built drivers

The SCXMC-HDLC card operates through the XMC interface of the SBC and provides real-time communication for control and status data based on synchronization signals. It supports serial communication via the SBCRTM’s Micro D-sub 37-pin connector using a standard D-sub 9-pin interface, allowing long-distance transmission through LVDS signaling. With four transmit/receive channels, it achieves 1–8 Mbps per channel and delivers low-latency performance of less than 40 µs for real-time operations. A device driver program is required for operation, and the Linux driver can be downloaded from Seedcore’s product page. Drivers for other operating systems can be developed upon request. This module is deployed in the L-SAM multi-function radar system, enabling fast and reliable control data communication across mission-critical components.

1. Filler Metal Name Material/Alloy AWS W-No. ISO-No. Nickel 61 Ni A5.14 ERNi-1 2.4155 SiNi2061 MONEL® 60 Ni-Cu A5.14 ERNiCu-7 2.4377 SNi4060 MONEL® 67 Cu-Ni A5.7 ERCuNi 2.8037 SCu7158 INCONEL® 72 Ni-Cr A5.14 ERNiCr-4 SNi6071 NC 80/20 Ni-Cr 2.4639 INCONEL® 82 Ni-Cr A5.14 ERNiCr-3 2.4806 SNi6082 INCONEL® 622 Ni-Cr-Mo A5.14 ERNiCrMo-10 SNi6022 INCONEL® 625 Ni-Cr-Mo A5.14 ERNiCrMo-3 2.4831 SNi6625 INCO-WELD® 686-CPT Ni-Cr-Mo A5.14 ERNiCrMo-14 SNi6686 INCO-WELD® 725NDUR Ni-Cr-Mo A5.14 ERNiCrMo-15 SNi7725 INCO-WELD® C-276 Ni-Cr-Mo A5.14 ERNiCrMo-4 2.4886 SNi6276 INCONEL® 52 Ni-Cr-Fe A5.14 ERNiCrFe-7 SNi6052 INCONEL® 52M Ni-Cr-Fe A5.14 ERNiCrFe-7A INCONEL® 92 Ni-Cr-Fe A5.14 ERNiCrFe-6 SNi7092 INCONEL® 617 Ni-Cr-Co-Mo A5.14 ERNiCrCoMo-1 2.4627 SNi6617 NILO® CF36 Ni-Fe INCOLOY® 65 Ni-Fe-Cr A5.14 ERNiFeCr-1 SNi8065 INCONEL® 718 Ni-Fe-Cr A5.14 ERNiFeCr-2 2.4667 SNi7718 Titanium Grade 1 Ti A5.16-90 ERTi-1 Titanium Grade 2 Ti A5.16-90 ERTi-2 Titanium Grade 5 Ti-Al-V A5.16-90 ERTi-5 Titanium Grade 7 Ti-Pd A5.16-90 ERTi-7 2. Electrodes Name Material/Alloy AWS W-No. ISO-No. Nickel 141 Ni A5.11 ENi-1 2.4156 ENi2061 MONEL® 190 Ni-Cu A5.11 ENiCu-7 2.4366 ENi4060 MONEL® 187 Cu-Ni A5.6 ECuNi 2.0838 ECu7158 INCO-WELD® A Ni-Cr-Fe A5.11 ENiCrFe-2 2.4805 ENi6092 INCONEL® 152 Ni-Cr-Fe A5.11 ENiCrFe-7 ENi6152 INCONEL® 182 Ni-Cr-Fe A5.11 ENiCrFe-3 2.4807 ENi6182 INCONEL® 112 Ni-Cr-Mo A5.11 ENiCrMo-3 2.4621 ENi6625 INCONEL® 122 Ni-Cr-Mo A5.11 ENiCrMo-10 ENi6022 INCO-WELD® C-276 Ni-Cr-Mo A5.11 ERNiCrMo-4 2.4887 ENi6276 INCO-WELD® 686CPT Ni-Cr-Mo A5.11 ERNiCrMo-14 ENi6686 INCONEL® 117 Ni-Cr-Co-Mo A5.11 ERNiCrCoMo-1 2.4628 ENi6617