It is an UAV recovery system that lands a fixed-wing UAV even in mountainous terrain where there is no sufficient runway for landing. The UAV is damping through a net mounted on the vehicle and lands on an air-cushion mat. It has the advantage of being easy to deploy in places where vehicles can enter and exit. But the type of the aircraft capable of stable landing is limited.

The ACTUS® ARKS3245 (3-24X, 56mm FFP) Long Range Riflescope is expertly designed for precision and durability, meeting the demanding needs of professional users across a wide range of environments. With a First Focal Plane (FFP) optical design, it ensures fast and accurate target coverage at all magnification levels. The illuminated reticle provides clear and smooth targeting even in low-light conditions, such as at dawn or dusk. Whether you're operating in challenging or ever-changing environments, the ACTUS® ARKS3245 is the ideal riflescope to deliver superior performance when accuracy and reliability are crucial.

A Very High Resolution (0.75 m GSD) and Wide-Field of View (24 km swath) optical payload under development. Designed for microsatellite integration, Chouette combines sub-meter detail with wide-area coverage, a unique balance that expands the scope of commercial EO applications beyond what current systems offer.

40mm, 76mm, 105mm, 127mm, 155mm Proximity Fuzes Multi-Function Fuzes

[LEO GNSS-R] Satellite : LEO RF Characteristics : GPS L1/L5, Galileo E1/E5a(option) Accuracy : Position ≤ 10m(3DRMS), Velocity : ≤ 1m/s Raw Data Accuracy : Pseudo-Range : 1m(RMS) Carrier-Phase : 10mm(RMS) Data Output Rate : 1Hz 1PPS Accuracy : Sync to GPS Time Data < 1us (1PPS Accuracy < 1.5us) TTFF : Cold Start ≤ 20min / Warm Start ≤ 10min Dara Interface : MIL-STD-1553B, RS-422(Data Interface) [GEO GNSS-R] Satellite : GEO RF Characteristics : GPS L1/L2C/L5, Galileo E1 Accuracy : Position :: ≤ 30m(3DRMS), Velocity : ≤ 1m/s Raw Data Accuracy : Pseudo-Range : 1m(RMS) Carrier-Phase : 10mm(RMS) Data Output Rate : 1Hz 1PPS Accuracy : 2us(RMS)/Sync to GPS Time Data TTFF : Cold Start ≤ 45min / Warm Start ≤ 20min Dara Interface : MIL-STD-1553B EEE Parts : ITAR Free Parts

ORSKOREA’s high frequency grinding spindles, operating at speeds up to 120,000 rpm—the highest level in Korea—are engineered for ultra-precision and durability in critical defense and aerospace applications. In addition to belt-driven, built-in motor, hydrostatic, and hydrodynamic types widely used in semiconductor and precision equipment, our spindles are customized to deliver the exact speed and power output required by customers. With over 25 years of expertise in repairing and retrofitting leading Japanese, German, and Swiss brands such as TOYO, KOYO, OKUMA, GMN, and Fischer, and with multiple proprietary patents including joint developments with Schaeffler Korea, ORSKOREA ensures proven reliability. These spindles are ideal for machining high-value defense components such as armored vehicle gears, drone actuators, aircraft engine parts, multispectral sensor housings, and advanced optical or communication devices, supporting the competitiveness of both defense and civilian manufacturers.

Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation XFrame® Dynamic Load Carrige® compatible Compatible with our entire accessories line Flush admin chest pocket with internal elastic straps PALS webbing for MOLLE attachment Zipper for Assaulter's Zip-On Back Panels QASM buckle system Holds up to five 5.56mm magazines Internal plate pocket retention straps accommodate several different plate thickness Soft armor included Composition Material: 500D Cordura® + ARAMID/PV® Size : Small / Medium : 8.5" x 11.5” -9.3" x 12.3" Plate Pocket Front Panel Area of Coverage : Length 13.25” Width 11" Large / XLarge : 10" x 13"- 10.9" x 13.8” Plate Pocket Front Panel Area of Coverage : Length 15" Width 12" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.