Hermetic connectors are essential to maintain system integrity in applications where the reliability and performance of electrical connections is critical, such as gas-tight barriers or high-pressures differentials.

The EPL4000, like the EPL2000, is an all-in-one RU/DU/EPC/application server system that provides seamless outdoor LTE service without backhaul connection. It offers a service radius of several kilometers and is optimized for installation inside ships and vehicles.

The EPNR2000 is a backpack-style, portable base station integrating CU-DU-RU, with a 5G Core and application (IP-PTT) server built in. All 5G network elements are combined into a single unit, allowing it to operate as a standalone base station (IOPS), making it an ideal system for providing communication in areas inaccessible by vehicle, such as disaster sites or military operations.

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm  

1. Integrated Production System Equipped with in-house CF-SMC compression molding equipment, we provide a complete one-stop solution—from sheet production to final composite molding—tailored to customer requirements. This ensures both exceptional quality and production efficiency. In line with ESG management, we also utilize our proprietary recycled carbon fiber technology to recycle CFRP waste generated during CF-SMC production. 2. Moldability & Productivity ILSUNG’s carbon fiber SMC technology offers superior moldability compared to conventional continuous CFRP and aluminum. With a rapid curing speed of about 1 minute per 1 mm thickness, it enables high-speed, mass production. Complex and precise geometries can be molded reliably, delivering strong competitiveness for both simple and highly engineered components. 3. Exceptional Lightweight Performance CF-SMC has a lower density than aluminum castings while maintaining high mechanical strength, delivering the optimal lightweight solution for industries where weight reduction is critical. 4. Balanced Performance This technology not only achieves lightweight properties but also ensures a well-balanced combination of mechanical strength, corrosion resistance, dimensional stability, and durability. It maintains stable performance under extreme environments and repeated loads, making it highly suitable for automotive, aerospace, and defense applications where reliability is critical. 5. Cost Competitiveness Compared to CFRP, it provides a lower-cost structure and high-speed molding capability, ensuring excellent price competitiveness. This significantly improves cost efficiency in industries that demand large-scale production—such as automotive, aerospace, and defense—and strengthens its growth potential within the composites market.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

With an unrivalled pedigree of delivering the pilots of the future for air forces across the globe, Hawk is the world's most successful and proven military aircraft trainer - with operational capability.

CAPHMICRO has the ability to design and manufacture wire harnesses and cable assemblies for defense, aerospace, and space launch vehicles/satellites. We design and manufacture in compliance with IPC-620 and J-STD-001 standards. Additionally, we have a global supply chain capable of quickly supplying a wide range of materials. We provide comprehensive solutions for wire harnesses, from design through to manufacturing and inspection.