Model-Based Systems Engineering (MBSE) is a methodology that integrates design, analysis, and verification activities throughout the system lifecycle using architecture models. By modeling requirements, functions, structure, and behavior, MBSE supports consistent and informed decision-making. Ansys SAM (System Architecture Modeler) supports the latest system modeling language, SysML v2, and enables both graphical and textual modeling, real-time collaboration, and model management. Ansys ModelCenter integrates various engineering tools and builds automated workflows, enabling what-if simulations and trade studies. By connecting architecture models with simulation models, it supports consistent design analysis and requirements validation using a single source of truth (ASoT).

- Fire response time: 0.004 seconds - Fire monitoring range: cone angle of 90° or greater - Equipped with self-diagnostic function - Capable of distinguishing between major fires and minor fires

ORSKOREA’s thread grinding machines are designed for high-precision machining of both internal and external threads, covering a wide range of thread profiles and dimensions. These machines are critical for producing aerospace fasteners, defense system parts, precision ball screws, and other components where accuracy and durability are vital. Key Advantages • CNC Control: 4-axis (SGTE) and 5-axis (SGTI) for complex thread profiles • High-rigidity structure minimizing vibration and thermal distortion • Built-in dressing and balancing units for consistent quality By shortening processes and improving efficiency, ORSKOREA’s thread grinders reduce costs while enabling high-value, high-accuracy production. They also serve as advanced domestic alternatives to imported machines, strengthening localization and export competitiveness.

옥외 스펙트럼 모니터링 및 위치 탐지 솔루션 R&S®UMS400 범용 모니터링 시스템은 8kHz에서 8GHz까지 스펙트럼 모니터링 및 방향 탐지를 지원합니다. 또한, R&S®CS-MC20 마이크로파 컨버터를 통해 최대 20GHz까지 확장할 수 있습니다. 무선 통신 서비스의 주파수 범위가 점점 증가함에 따라 최대 8GHz, 경우에 따라 최대 20GHz까지 모니터링 스테이션이 필요합니다. 일반적으로 가장 높은 감도를 위해 케이블 손실을 최소화하기 위해 안테나 근처에 모니터링 센서를 설치해야 합니다. R&S®UMS400과 R&S®CS-MC20 모두 옥외 하우징 옵션을 통한 야외 설치가 가능합니다.

Spring probes are designed to optimize performance in high reliability, multicycle applications. Smiths Interconnect’s spring probes are compliant which makes them ideal for blind mate applications as they self correct for x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency applications. Mixed signals and functionality can be designed into a single connector.

With expertise in manufacturing guidance, navigation, and control (GNC) products, we have been used in over 2,000 spacecraft. Adaptable for size, moment, and power to meet optimal system requirements. Redundant windings available. Current, speed, and torque control. Simple digital interface to the spacecraft bus. Hermetically sealed. Long demonstrated lifetimes. ISO 14644-1 state-of-the-art cleanroom facility. ISO 9001:2015 certified.

MIL-DTL-26482 seriesⅡ has the same contact arrangement as MIL-DTL-26482 series I, and the bayonnet coupling method is applied. The connection between the contact and the wire is a crimping method, which is different from 26482-I. It provides reliable fastening with 5 guide keys. It also has excellent EMI shielding ability and can be used with various additional parts of the M85049 standard, so it is applied to aviation, space, and various high-tech precision equipment.

The Glenair next-generation STAR-PAN NG ecosystem incorporates a range of new capabilities in direct response to requests from JTACs, special operations forces, mission commanders, and other military specialists. Design innovations in STAR-PAN NG have resulted in higher current-carrying capabilities, greater versatility in power input support, and real-time plug-and-play USB device integration. The STAR-PAN NG hub and cable series offers a number of interface improvements and circuit board innovation.