The iGRVT-50 is InterGravity Technologies’ next-generation green-propellant orbital transfer vehicle (OTV), purpose-built for the rideshare launch ecosystem. iGRVT-50 enables small payloads (up to 15–20 kg class) to be deployed or serviced in a wide range of orbits. Key Features - Payload Capacity : Up to ~20 kg class hosted payloads - Propulsion System : 20 N green bipropellant thrusters (C₂H₆/N₂O) - Delta-V Capability : > 450 m/s - Communications : UHF, S-band TM/TC, X-band downlink

A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

Our transport drone is designed for efficient and reliable cargo delivery. With precise and stable flight performance, it supports real-time monitoring of delivery routes and environments through an advanced camera system, ensuring safe and timely operations.

The MD70MH-DroneCAN is an 11.6mm, metal gear, 13-gram micro servo for higher voltage applications. Featuring a single output ball bearing, cored brush motor, and magnetic rotary encoder, the MD70MH-DroneCAN is often used in compact fixed wing UAV and drone applications where space and weight are mission critical concerns. The MD70MH utilizes DroneCAN (formerly UAVCAN) control at a voltage range from 4.8~7.4 volts. #UAV #UAS #UGV

This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

A device that integrates and displays comprehensive navigation information for submarines, enabling operators to control various navigation sensors and systems while supporting mission execution. - Compliant with MIL-SPEC standards (shock, vibration, temperature/humidity, EMI/EMC) - Mechanically engineered design for improved maintainability

Ultisense™ is Safran Vectronix’s line of high-performance OEM sensing modules, including ultra-compact Laser Rangefinders (LRF) and Digital Magnetic Compasses (DMC). Designed for seamless integration into military and civilian systems, they offer exceptional accuracy, ruggedness, and Swiss precision. LRF modules measure distances up to 30 km with ±1 m accuracy, while DMC modules provide azimuth accuracy down to 0.25°, even under extreme shock and environmental conditions.

In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.