The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

As domains converge and connect, new threats and opportunities emerge. By giving our service members every advantage for operational success, we create a safer world. It is this mission that drives our relentless innovation in defense technology. With our integrated expertise and capabilities, Raytheon Technologies is uniquely positioned to give our customers the advantage in every moment.

Developed by MPS Microsystems, the voice-coil nano-positioner unites a Lorentz-force motor, flexure guidance and on-board electronics inside a 65 × 60 × 38 mm envelope. Standard travel is 2.88 mm, extendable to 7 mm with the same coil, suiting microscope objectives, small mirrors and sensors that demand friction-free motion. Bidirectional repeatability stays within ±1 µm over a 360 µm stroke and ±2.5 µm across the full stroke. We can tailor mounting plates, objective clamps and cable exits to suit your specific requirements, ensuring that this voice-voil actuator can be integrated seamlessly into your system.

CPPA Procedure : 1. Requirement Analysis for Customer's parts Purchasing 2. Parts Purchase Negotiations 3. Parts Purchasing Management 4. Component Reliability Testing 5. Space Parts Documentation Support 6. Delivery to the Customer

BERNIER designed the CMA-USBC line specially for equipment in harsh environments. The CMA-USBC connectors are Push-Pull military connectors that offer many possibilities of electronic integration as : USB Memory key, Authentification key, Wireless module, Crypto and Shunt module…

Stocking distributor of: aircraft landing gear, ground support, and LED lighting components Stock for contract support - reduces cost and lead times Build-to-print network of ISO-Certified manufactures and OEMs Same-day-shipment of in-stock material In-house military packaging, barcoding, RFID, and WAWF