MY PROFILE
Access
Your company has access to 50% of the platform's feaures. Need more?
한국어로 페이지 보기
Seoul ADEX 2025 Digital Directory
Plan your trip to Seoul ADEX 2025 using our state of the art Digital Directory
Register in seconds with just your email
Directory Features
To help you at the show
In-depth Exhibitor Profiles
Each exhibitor can add as many products and services as they wish, with in-depth information and specifications. This allows buyers to find what they want easily.
Self Provisioning for Exhibitors
Each exhibitor has full control of their content - to edit their company profile, upload products and enter staff details.
Plan your trip
Use the bookmarking and event planning tool to research the companies you would like to visit and the products you are interested in finding. You will be able to locate all of your saved companies on our floorplan
Advanced Search
Utilize our advanced search function to quickly locate products, people, and companies. Our state-of-the-art technology thoroughly scans all exhibitor information, delivering precise and relevant results
Interactive Floorplan
Navigate the show effortlessly with our directory. Use the floorplan to locate companies you want to visit and to find your way to onsite restaurants, toilets and site entrances and exits.
On-platform Messaging
Reach out to exhibitors and visitors directly on our platform to set up meetings, or request more information.
Some of our latest content
Companies, Products, News, Events
AeroMaster Corporation (AMC)
DTMU
Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G
TBT Inc
EO/IR System TBX-40
High-performance video tracking camera UVA, a high-performance long-distance tracking camera optimized for aircraft such as helicopters. 2-axis, 3-axis, 4-axis and various sensors can be installed. Depending on your needs, you can choose from various options such as LRF, SWIR, and Pointer.
Glenair
EMI / RFI Braided Cable Shielding / Tubular Expandable Braided Cable Sleeving / Ground Straps
Metal braided sleeving and tubular expandable braided cable shielding is used primarily in the electrical wire interconnect industry to protect cables from electrostatic and electromagnetic interference. The interwoven conductive wire acts as a ground-path barrier that attenuates cable electrical field interference. In addition, both metallic and non-metallic braided shielding provides abrasion and cut protection for critical wiring, a particular concern in environments, such as aircraft, where vibration or other forms of rough handling may result in damage to individual wire conductors and cable bundles. Glenair manufactures the world's most innovative line of metal, monofilament non-metallic, and microfilament composite and stainless steel braiding solutions for environmental, mechanical, and EMC shielding in interconnect cable assemblies. Our industry-leading ArmorLite braided shielding is manufactured from ultra-lightweight stainless steel microfilaments, metal-clad for optimal conductivity and EMI/RFI shielding. Our AmberStrand tubular braided shielding is built from a lightweight composite thermoplastic microfilament, with or without additional metal filaments and plated for outstanding grounding and shielding protection. From high-temperature fiberglass tubular shielding for engine applications to ultra-lightweight EMI/RFI braided shielding for electrical wire interconnect grounding applications, Glenair offers the industry's most innovative range of solutions.
Hessed Korea
HURON ALPHA JACKET
Durable, ultra-light-weight, body temperature protection Extremely light-weight & packable YKK Zipper Wrist cuffs to prevent heat Elastic string applied to the hem Composition Outside : DWR Water Repellent 70D Ripstop Nylon Filling : POLARTEC's ALPHA meterial Size : SM, MD, LG, XL, 2XL Colors MC (MultiCam)
Register Now to view the Directory
Right Now.
View page in English
Seoul ADEX 2025 Digital Directory
디지털 디렉터리를 사용하여 서울 ADEX 방문 계획을 수립하세요
이메일로 간편 등록할 수 있습니다
디렉터리 기능
전시회 도우미
In-depth Exhibitor Profiles
Each exhibitor can add as many products and services as they wish, with in-depth information and specifications. This allows buyers to find what they want easily.
Self Provisioning for Exhibitors
Each exhibitor has full control of their content - to edit their company profile, upload products and enter staff details.
방문 계획 수립
북마크 도구와 이벤트 플래너를 사용해 방문하고자 하는 기업과 관심 있는 제품을 검색하세요. 저장한 모든 항목을 조회할 수 있습니다
고급 검색
고급 검색 기능을 사용하여 상품, 인물, 기업의 위치를 빠르게 조회할 수 있습니다. 최첨단 기술을 통해 모든 참가사의 정보를 철저히 스캔하여 세밀하고 관련성 있는 정보를 제공합니다
상호작용 가능 평면도
디렉터리를 사용해 전시회를 손쉽게 둘러보세요. 방문하고자 하는 기업의 위치와, 행사장 내 식당, 화장실, 출입구를 평면도에서 찾을 수 있습니다.
플랫폼 내 메시지
플랫폼 상의 전시 참가사와 관람객에게 직접 연락하여 미팅을 신청하거나 추가 정보를 요청하세요.
최신 콘텐츠
기업, 상품, 뉴스, 이벤트
Sangdo Electronics co.,Ltd
Nebula Series
The Nebula connector employs the renowned Hypertac hyperboloid contacts as the bedrock of its high reliability providing immunity to shock and vibration fretting and over 100,000 mating cycles. These features combine with current carrying capacity up to 1.5 Amps per contact and low insertion / extraction forces to provide significantly enhanced quality and reliability performance compared with other more commodity connector solutions. Available for direct mounting to PCB, the Nebula Series supports independent function for all its 22 contacts. It also offers optional quarter-turn locking hardware for faster connector securing and to prevent unintentional separation.
DN Solutions
DVF series
Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)
Shield AI
Hivemind - Autonomous AI Pilot
The First & Only Autonomous AI Pilot Deployed Since 2018

Similar to a human pilot, Hivemind reads and reacts to the battlefield, and does not require GPS, waypoints, or comms to make decisions. Hivemind enables intelligent teams to perform missions ranging from room clearance with Novas, penetrating air defense systems with V-BATs, to dogfighting F-16s.

Intelligent Teaming

Shield AI’s synthetic environments combined with human-machine tactics and behaviors. Testing and learning in real physics simulations reduces engineering cycle times and enables rapid real-world deployment. Welcome to the defense metaverse.

Edge Autonomy

The aircraft uses sensors to create a map or world-view, the computer then tells the aircraft or autopilot where to go and what to do to execute its mission. No GPS, no waypoints, and no comms are needed for aircraft to accomplish their missions.
Tescan Group a.s.
TESCAN TENSOR
Explore nanoscale structure with clarity, speed, and confidence. Tescan’s STEM solutions are purpose-built for advanced materials research, semiconductor analysis, and detailed nanoscale characterization. With integrated 4D-STEM, precession-assisted diffraction, and synchronized EDS workflows, our instruments deliver actionable insight with unmatched usability—whether you're mapping strain, analyzing phases, or accelerating failure analysis and R&D.
지금 바로 등록하여 디렉터리를 열람하세요
지금 바로 등록하여 디렉토리를 열람하세요
Right Now.
We use cookies

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.