Digitally recorded distressed and alarmed birds, along with the sounds made by their natural predators are broadcast through high output weather-resistant speakers. This triggers a primal fear and flee response. Super easy installation figure makes the systern portable across crop and place Replaceable, customizable species specific bio- acoustic sound chip according to birds kinds and specific regions Effective Coverage: Up to 50m for one single direction, approximately 5,000 square meter Technology integrated operation system enables sound duration and interval to prevent habituation to the sounds Overcharge, over-discharge protection Sound Pressure: 120-130 db at 1 meter Frequency: 3-5 kHz With severe bird infestations, it is always recommended to use at least 2 bird control methods together. Sonic cannon is a very good to use in conjunction with the bio-acoustic bird repeller.

Drones can also be remotely controlled using a control system for real-time route changes, mission aborts, emergency returns, and area patrol commands. Furthermore, based on their precise attitude control and location recognition capabilities, they can define and perform tasks such as recognizing specific objects and precisely landing at designated locations.

Ekinox Micro combines a high-performance MEMS inertial sensor with quad-constellation, multi- frequency dual-antenna GNSS receiver to provide unmatched accuracy even in the most challenging applications. Designed to operate in the harshest conditions, Ekinox Micro is military standard compliant, making it the ideal choice for any mission critical application.

The VPX3-C11 which provides a full 3U OpenVPX(VITA 65) is a Single Board Computer(SBC) that combines the power, versatility, cost-effectiveness of the 11th generation Intel Xeon W processor and RM590E PCH chipset with the reliability. VPX3-C11 is based on the Intel Xeon W- 11865MLE CPU that has 8 cores running at max 4.5GHz and providing 32Gbytes of high-bandwidth DDR4 SDRAM. Intel Xeon processor includes an integrated Intel UHD Graphics 11th Gen(32 EU) graphics engine, providing discrete GPU performance with OpenGL for graphicsintensive applications. For storage application VPX3-C11 provides the built-in 80GB SLC NVMe SSD solution via PCIe x4 lanes as well as the external SATA expansion through VPX site. The VPX3-C11 satisfies the demanding applications ranging from tactical aircraft to armoured vehicles to rugged industrial systems, with its rich complement of features and I/O including Intel Graphics, Integrated Platform Management Interface, Gigabit Ethernet, DIO, Serial channels, USB ports and more. Especially VPX3-C11 was designed to keep the pin compatibility with VPX3-C11, previous 6th Generation model in terms of I/O interface signal arrangement.

SAS(360° Situation Awareness System) is a day and night multi sensor system, giving the capability of 360 degree’s situational awareness in the battle field. SAS comes with an uncooled thermal camera as well as a day CMOS sensor supplying crew members in the vehicles with the information out of vehicle for better situational awareness. Each SAS camera provides 90° filed of view and up to 360° with more cameras onto the various kinds of vehicle. SAS-PTV(Panoramic Triple Vision) - Single and Duo (PTV-S / PTV-D) is the device that forces can be aware of 360° surrounding situation in the vehicles through It can me mounted onto M1A1/A2, K1A1/A2 and any other vehicles for optimal performance in complete darkness for driver and commander PTV-S or PTV-D with Wide Field of View provides an optimal image quality an situational awareness capability of the forces SAS comes with an uncooled thermal camera as well as a day CMOS sensor supplying crew members in the vehicles with high definition video for better situational awareness.

KAI participates in the system integration of the KSLV-II and development of its first-stage propellant tank while trying to secure the technology of Space Launch Vehicle.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

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