In order to guarantee the quality requested by customer, we have been implementing thorough quality control based on ISO9001, ISO14001, TSI6949, the National Defense Quality Management System and SQ processor.

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

The iGRVT-50 is InterGravity Technologies’ next-generation green-propellant orbital transfer vehicle (OTV), purpose-built for the rideshare launch ecosystem. iGRVT-50 enables small payloads (up to 15–20 kg class) to be deployed or serviced in a wide range of orbits. Key Features - Payload Capacity : Up to ~20 kg class hosted payloads - Propulsion System : 20 N green bipropellant thrusters (C₂H₆/N₂O) - Delta-V Capability : > 450 m/s - Communications : UHF, S-band TM/TC, X-band downlink

The HPC2812 is a rugged 6U VPX high-performance computer aligned with the compute-intensive SOSA profile, delivering top-tier processing with dual Intel® Xeon® D-2700 (Ice Lake-D) processors and flexible expansion capabilities. • Supports up to 128 GB DDR4 SDRAM with ECC and 480 GB NAND Flash (NVMe SSD) per node • Offers 2× 100 GbE (or 4× 40 GbE) data plane with RDMA, PCIe Gen 4 expansion plane, plus control and management plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security

A compact EO/IR gimbal camera system designed for UAVs, unmanned surface vehicles, and defense platforms. The system integrates a QVGA/VGA-class LWIR thermal imager and a high-resolution EO camera within a stabilized gimbal, ensuring reliable performance in diverse environmental conditions. Optimized for ISR (Intelligence, Surveillance, Reconnaissance) missions, the system provides detection, recognition, and identification (DRI) capabilities with low-SWaP (Size, Weight, and Power) characteristics.

The core of the next-generation intelligent protection system Efficiency in the battlefield environment by building a highly intelligent weapon system with multiple spraying control technology for precise injection and remote control of multiple objects (intelligent mines), complex sensor-based intelligent ammunition design technology, and platform interlocking and cluster attack protection system integrated design technology. Development is underway to maximize effectiveness. Instead of conventional mines, we integrate technologies used in the 4th industrial revolution such as wireless power transmission, wireless communication, complex sensor control swarm control algorithm, and signal processing between location information, and develop the core technology of the intelligent mine system to efficiently operate the weapon on the battlefield. You can maximize the effectiveness of the system.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

FIRSTEC is providing key components of guided weapon, such as Actuation System, Gudiance Control Unit, Fire Control Unit, and wire harness, to complete systems such as Hyunmoo, Raybolt(Hyungung), Bigung(Poniard), M-SAM II(Cheongung II), L-SAM etc. applying them to each business.