The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

A lightweight high tensile aluminium frame, suspended by elastomeric anti-vibration mounts, provides superior ‘sway-space’ between the frame and the outer container and is the best possible way to safeguard delicate equipmentMore robust and stainless steel variants are custom-made for heavy payloads and corrosive environments. Enhanced ‘sway space’ between inner frame and outer case to prevent contact with outer container All our 19 inch Amazon Racks have a ‘user adjustable’ inner frame allowing back to front movement of 50mm within the outer container to accommodate front panel and rear wiring/ connector needs. Optional ‘EasyGlide’ removable, self anchoring, internal frame system Standard, stainless steel M6 threaded fasteners secure electronic equipment into floating stainless steel cage nuts at both front and rear of frame. All our 19 inch Amazon Racks have positive stacking, aligning at the front face regardless of rack depth

With a proven track record of innovation, quality and reliability, Microchip continues to evolve as the foremost supplier of semiconductors to the aerospace and defense market. Our rapidly-expanding portfolio of highly-integrated technology supports the most demanding requirements for space, aviation and defense microelectronics. From radiation-hardened, space-grade solutions to advanced military and commercial aviation electronics, we've leveraged our expertise and product knowledge to build applications-based solution platforms that reduce integration risk, improve productivity and speed time to market. - More than 60 years of space flight heritage with products qualified to the highest government, DLA, NASA and ESA standards - Proven innovation, quality and reliability on aerospace platforms over the past 20 years - Legacy of trusted, reliable and cyber-secure supply chain for defense microelectronics

Mini size - Shell size 11
Compatbile With: TE Pro Beam mini, QPC Qmicro, Stratos HMC, Fibreco Mini2

The HXB11 Connectors, featuring expanded beam technology, hermaphroditic connection, rugged construction for field deployment have been designed for harsh environment applications such as military tactical communications, avionics, offshore systems, outside broadcast, mining and plant.

The expanded beam technology uses expanded and collimated beams to couple optical fibers without any contact. It could allow for optics to be used in areas that have been quite restrictive due to presence of damage or contamination at the fiber end. Hermaphroditic connector design enables fast deployment by daisy-chaining multiple cable segments.

FEATURES
· Advanced expanded beam technology
· Rugged field deployable fiber optic connector
· Hermaphroditic interconnection
· 2 to 4 Optical Channels for Singlemode or Multimode
· Custom configurations available
· Environmental sealing (IPX8)
· Very high resistance to vibration, shock, environmental effects, dust, and debris

The SWE450S is a rugged 3U VPX fully managed Layer-2/3 Ethernet switch aligned with the compute-intensive SOSA profile, delivering high-performance 25/100 GbE switching and flexible I/O reconfiguration. • High-performance 2 Tbps switch fabric with wire-speed throughput • Front: up to 2x 100 GBASE-SR4 (MPO); Rear: 25/100 GbE KR4, 100/1000 BASE-T, USB-C, RS-232Reconfigurable fat-pipe to thin-pipe ports, speed downgrading capability • Dual-core ARM + OpenWare™ management, sanitization support • SOSA-aligned (SLT3), rugged air- & conduction-cooled options

Main Fuel Control, Servovalve, Switches, Indicators, Starter Generator, Power Unit, Gas Turbine, Control Unit, Ice Detector, Blade, Advanced Flight Control Computer, Manifold Assembly, Main Battery, Ring Bearing, Power Supply, Motor, Sensors

Digitally recorded distressed and alarmed birds, along with the sounds made by their natural predators are broadcast through high output weather-resistant speakers. This triggers a primal fear and flee response. Super easy installation figure makes the systern portable across crop and place Replaceable, customizable species specific bio- acoustic sound chip according to birds kinds and specific regions Effective Coverage: Up to 50m for one single direction, approximately 5,000 square meter Technology integrated operation system enables sound duration and interval to prevent habituation to the sounds Overcharge, over-discharge protection Sound Pressure: 120-130 db at 1 meter Frequency: 3-5 kHz With severe bird infestations, it is always recommended to use at least 2 bird control methods together. Sonic cannon is a very good to use in conjunction with the bio-acoustic bird repeller.

Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.