Pandion Perception provides a robust solution for autonomous navigation, Advanced Driver Assist (ADAS) and mapping in GPS-denied environments, efficiently generating the low-latency spatial data that every autonomous system needs. Mounted on ground vehicles or uncrewed platforms, our 3D spatial sensing systems enable operation environments where GPS is degraded or denied - such as dense urban areas, subterranean infrastructure, or contested military theatres. These capabilities are tailored for missions and logistics operations, offering reliability and precision where traditional systems fail.

Inverter platform developed by entirely by Drive System Design with a focus on versatility and flexibility, resulting in a powerful and highly versatile hardware and electronics base platform, which can operate: - From 200 to 800V and beyond, - At a Continuous Output of 450A rms - Delivering an output Power up to 300kW and - A PWM frequency from 20 to 30kHz

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

LW-DED 3D printing head module for Morphing Shield Technology. Morphing Shield Technology builds aportable inert gas enviroment surrounding the melting zone for laser wire DED Process.

Low Size, Weight and Power (SWaP) at only 297g. Up to 100 TOPS GPU by NVIDIA® Jetson Orin™ NX Supports multiple camera and sensor interfaces 2x GbE and 2x USB3 for RGB/ Infrared/ hyperspectral cameras and lidar/ radar 2x GMSL2 for HDR/ 3D cameras Built-in UART and CAN to interact with flight controller 1x M.2 2230 for storage and 4G/5G communication ready Supports 4S-14S drone battery pack Compatible GMSL2 cameras with pre-built drivers

Utilizing optics, sensors, and precision measurement technologies, Sodern offers competitive solutions in a variety of fields, including space exploration, military, and neutron analysis. Sodern has achieved consistent growth and success in the space, defense, and neutron analysis markets, and is recognized internationally as a trusted partner. - 1/3 of global satellites are equipped with Sodern - World's Largest Star Tracker Portfolio +150 satellites carry Sodern's star trackers +550 star trackers already ordered +10 million hours of operation with 100% mission success - Two production facilities dedicated to high-end and low-cost star trackers

JWGE connector which was derived from the VG95234, was developed for low-voltage/high-current transmission and, when combined, exhibits IP68 water and dust resistance, also exhibiting excellent durability and mechanical performance in a temperature range of 55° to +125°C. These features are applied and utilized in military vehicles and various industrial equipment.

The SC6G0 series supports 4K60 hardware compression and UVC video output, with power options via PoE or USB Bus Power. Its built-in SoC delivers 2.5 AI TOPS, enabling seamless YOLO AI tool integration. This design streamlines system setup and connectivity, boosting flexibility and deployment efficiency across diverse AV applications.