The Series 23 SuperNine® advanced performance MIL-DTL-38999 connector series provides many of the technology advances exceeding MIL-DTL-38999 Series III. Higher mating cycles, integrated banding porch, PC Tail and standoff availability and crimp termination Hermetics are all part of the family.

Type : Radial (3P) Size(L,W,H mm) : 193 × 100 × 100 Weight(kg) : 1.7 [Active] N. Speed(rpm) : 3,700 N. Torque(Nm) : 5 N. Power(kW) : 2

RFcore has been innovating MMIC solutions for phased array system pursuing more ease of use, higher performance, higher level of integration as well as lower cost. We believe that the most suitable way is exploiting properties of God gifted semiconductor Silicon and GaN. We aim at integrating all components of TRM for active phased array on single die and even multi-channel TRM too.

OZVPX3-410 is Olzetek's flagship 3U product. Olzetek's 3U Platform Family has maximum scalability using Xilinx Zynq® UltraScale +MPSoC, which is capable of a high-performance Arm®-based multi-core and multi-processing system, as well as video signal/packet processing functions, graphics and video pipelines. This is a SoC product designed to meet challenging demands by offloading essential applications to dedicated processing blocks and supporting major peripherals and interfaces. The OZVPX3-410 product is an ideal solution that can be applied to applications requiring Analog Video (PAL/NTSC) encoding and decoding and includes customization options (consignment development) according to specific video inputs, requirements analysis, and design. We also provide consignment development of a complete Video 3U Platform.

InspecX is a next-generation autonomous swarm inspection system for aircraft. It is addressing challenges in the $100B global aviation maintenance market. Airlines face a shortage of certified technicians, with Boeing projecting demand for over 700,000 by 2044. Aircraft-on-ground (AOG) incidents cost $10,000–$150,000 per hour, making downtime reduction critical. InspecX uses swarm coordination and LiDAR-based SLAM to perform safe inspections in GNSS-denied or indoor environments. It reduces required technicians from 9 to 3 and inspection time from 10 hours to 3, achieving over 50% cost savings for large aircraft. Beyond efficiency, InspecX helps airlines avoid AOG losses, accelerates maintenance cycles, and improves airworthiness. By maximizing fleet readiness and ensuring reliable operations, it provides a scalable, future-proof solution. InspecX is positioned to become the new global standard for aviation safety and maintenance in the era of intelligent mobility.

The Haigh-Farr family of rugged Blade antennas is available in frequencies ranging from UHF to upper C-band. Since 1972, our blade antennas have a demonstrated reliability of use in high-performance airborne applications. In addition, they are used extensively in ground-based vehicles such as race cars, trucks, tanks, and motorcycles, to name a few. 60XX & 61XX Series: Our 60XX & 61XX Series blade antennas have quasi-uniform null-free hemispherical gain patterns and may be provided in either straight or rounded blade configurations. 60XX and 61XX Series blade antennas are available in standard and high powered versions. With sufficient airflow, our standard blades handle an average power of 25 - 30W CW and our High Powered blades can handle an average power of 80W CW. These blade antennas share a common footprint with varying height. Multiband: Haigh-Farr Multiband blade antennas utilize identical materials and construction as our 60XX & 61XX series blade antennas with additional bandwidth. UHF: Haigh-Farr UHF blade antennas provide coverage down to 380 MHz and up to 470 MHz in two unique form factors. Our 6300-X series of blade antennas utilize identical materials and construction as our 60XX & 61XX series blade antennas in the larger blade structure required at UHF-band. Our P/N’s 16230-XXX and 16400-XXX are low profile, mechanically robust designs that can be custom tuned to meet discrete UHF frequencies, with an option to add thermal protection for high temperature environments.

Original compact design and long-term production know-how. System reliability and overall competitiveness.

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.