A compact EO/IR gimbal camera system designed for UAVs, unmanned surface vehicles, and defense platforms. The system integrates a QVGA/VGA-class LWIR thermal imager and a high-resolution EO camera within a stabilized gimbal, ensuring reliable performance in diverse environmental conditions. Optimized for ISR (Intelligence, Surveillance, Reconnaissance) missions, the system provides detection, recognition, and identification (DRI) capabilities with low-SWaP (Size, Weight, and Power) characteristics.

DIESTONE DLV is a next-generation cleaning solvent for aerospace and industrial surface preparation. With 70% VOCs, controlled volatility, low odor, and no chlorinated hydrocarbons, it ensures operator comfort and safer workshops. Its high flash point (49 °C / 120.2 °F) reduces fire risks while maintaining powerful cleaning and degreasing performance on metals and composites. Non-corrosive on light alloys, DIESTONE DLV also provides reliable reactivation of epoxy and polyurethane primers before painting, bonding, or sealing. Approved to key aerospace standards, including Boeing BSS 7432 and SAE (ARP1755B, AMS1528, AMS1536), it is trusted by OEMs and MROs worldwide. Available in multiple packaging formats, from bulk containers to pre-saturated wipes, it offers flexibility for both manufacturing and maintenance operations.

IP66-rated waterproof and dustproof design Intel® Alder Lake Core™ i3-N305 with 8 E-cores -40°C to 70°C temperature operation 2x 2.5GbE via M12 X-coded connectors 1x isolated RS-232, 1x isolated RS-422/485 via M12 A-coded connectors 3x isolated DIO and 1x CAN2.0B via M12 A-coded connectors Low power and high endurance FRAM for data logger Class 1, Division 2 and ATEX certification in hazardous area applications 8V to 35V DC input with ignition power control input via M12 A-coded connector

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. Welcome to Microchip, we hope to partner with you on a future project. We believe together we can accomplish anything.

A converter-integrated Main Generator installed in the T-50 series that supplies power to the system.

InterGravity Technologies has developed a Type-III Composite Overwrapped Pressure Vessel (COPV) optimized for high-performance small spacecraft propulsion systems. The tank is designed with an aluminum alloy liner for impermeability and a carbon fiber/epoxy composite overwrap for high strength-to-weight ratio. The system is tailored for green propellant storage (C₂H₆, N₂O), offering an exceptionally lightweight yet robust solution for orbital transfer vehicles and CubeSat-class platforms. Technical Specifications - Type : Type-III COPV (Al liner + CFRP wrap) - Volume : 5.3 liters - MEOP : 75 bar - Proof : 230 bar - Burst : 250 bar - Dry Mass : < 1.0 kg

Robotic technology that combines IoT and autonomous driving technologies provides key solutions for future mobility manufacturing. Main Functions Innovative manufacturing system using Collaborative Robot and Autonomous Mobile Robot ptimize production processes and provide logistics flexibility Ensuring Optimal Production Process Using AI Application Site HMGICs : Flexible Production Cells (smart manufacturing) Targeted to supply to global manufacturing sites