If it’s on our schedule, you’re invited. As an exhibitor in the Partnership Pavilion, in addition to official show events you also have exclusive access to official Pavilion events. Exhibitors benefit from exclusive access to the Partnership Pavilion events, including the official Pavilion Opening Ceremony and Ribbon-Cutting, off and on-site hospitality receptions, networking events, business and market insight briefings, and topical industry presentations.

Powerful multi-tasking capacity for higher productivity • Even higher multi-tasking capability is available from SMX machines through the combination of the left and right spindles, the B-axis milling function and a lower turret ideal- making the machines ideal for complex, high-precision machining. • Orthogonal structure maximizes machining space. • 12 station high-rigidity servo turret ensures accurate and powerful cutting performance, and outstanding process reliability. Outstanding control delivers higher precision • 0.0001-degree precision control function of B-axis and C-axis enables high-precision machining. • Minimized thermal displacement of the spindle and feed axis by the optimized cooling solution and smart thermal compensation ensure high precision even during long machining runs and extended use. Easy and convenient functions • Front located tool magazine and convenient ATC operation panel make it easy to change and replace tools, and monitor and check tool change operations. • Side-to-side movable swivelling operation panel with adjustable height settings. User friendly work guidance function. • User friendly work guidance function.

For Ground, Sea, Air, and Space Application

A VGA (640×480) LWIR (8–12 µm) uncooled micro-bolometer module with 12 µm pixel pitch and NETD ≤ 50 mK, paired with an F1.0, 10.7 mm EFL lens delivering H42° / V31.5° / D52.5° FOV. It streams at 30 Hz in either UVC (USB-C, 5 V) or GMSL1 (FAKRA, 12 V), with power consumption < 1.9 W. The compact, lightweight housing (30×30×58.9 mm for UVC; 30×30×70.9 mm with FAKRA for GMSL1; IP65; −40 °C to 85 °C) makes it well-suited for autonomous vehicles, UAVs, and security systems, providing reliable day/night thermal perception of pedestrians, animals, and objects in adverse weather.

This KF-21 fighter jet model is produced using advanced SLA (Stereolithography) additive manufacturing technology, providing both intricate detail and structural precision. Manufactured with industrial-grade ABS material, the model benefits from our fleet of six SLA machines, ensuring consistent quality and scalability for various production demands. Our in-house post-processing team delivers a wide range of finishing options, including custom color applications tailored to client specifications. Our company’s origins are rooted in expert prototype fabrication, and we have since evolved into a leader in additive manufacturing technologies. We support OEM production and prototype mock-up projects for diverse clients, building a reputation for technical excellence and collaborative development. The KF-21 model highlights our capabilities in precision model making, turning innovative designs into high-quality finished products.

The Sentry Mesh 6161 is a Software Defined Radio hosting our highly robust MANET waveforms that have been proven in applications from Public Safety to Unmanned Systems and Covert Operations. The MeshUltraTM waveform optimises the use of available channel bandwidth through a token passing technology, which avoids collisions and provides a bound, predictable data packet latency. Wider bandwidth, together with superior RF performance and optional Interference Avoidance System (IAS), maximises communications effectiveness in the presence of interference. The standardised design of the 6161 ensures that it can be integrated with a large range of accessory devices such as audio, data, power solutions, and antennas to address current and future program needs.

The HPC2812 is a rugged 6U VPX high-performance computer aligned with the compute-intensive SOSA profile, delivering top-tier processing with dual Intel® Xeon® D-2700 (Ice Lake-D) processors and flexible expansion capabilities. • Supports up to 128 GB DDR4 SDRAM with ECC and 480 GB NAND Flash (NVMe SSD) per node • Offers 2× 100 GbE (or 4× 40 GbE) data plane with RDMA, PCIe Gen 4 expansion plane, plus control and management plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security