Miniaturization model for UAVs Minimized Vibration & Noise by our technique Provide an electronic board Customized item for Military's needs

Presentation by Haigh Farr during the Virtual NH Career Fair, hosted by JobsInNH.

HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option.With a 0.6mm contact diameter, the HPH Series comes in 3-6 row configurations and is available up to 303 signal contacts on a 1.901mm staggered grid. Contacts are removable for ease of maintenance.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.

The 6-degrees-of-freedom (6-DOF) motion platform system utilizes six types of motion—heave, roll, pitch, surge, sway, and yaw—to replicate real-world environmental movements and verify the operational durability and reliability of test products. Possesses Korea’s only proprietary 8-axis expansion technology (6-DOF + 2 additional axes), developed in-house. Duratek designs and manufactures fully domestic electric motion platforms, with integrated capabilities covering software control, user interface (UI), and sensor fusion technologies.

Based on the T-50 trainer’s superior performance and an armament storing capability, the FA-50 aircraft is further developed and upgraded with Tactical Data Link, Precision Guided Munitions, and Self Protection subsystem. Featuring a fighter jet-class flight performance, the FA-50 aircraft has been deployed and operated in the Republic of Korea Air Force (ROKAF) since 2013.

Explore nanoscale structure with clarity, speed, and confidence. Tescan’s STEM solutions are purpose-built for advanced materials research, semiconductor analysis, and detailed nanoscale characterization. With integrated 4D-STEM, precession-assisted diffraction, and synchronized EDS workflows, our instruments deliver actionable insight with unmatched usability—whether you're mapping strain, analyzing phases, or accelerating failure analysis and R&D.

SJP’s connector components are designed and manufactured to meet the highest standards of precision and reliability across industries. Equipped with state-of-the-art CNC multi-tasking machines and extensive know-how, we deliver solutions ranging from fine threading to complex geometries. Our connectors are widely applied in electronics, medical devices, aerospace, and defense, where durability and stable connectivity are critical. Through customized design services and fast lead times, we help our clients enhance their product competitiveness.