A rotating component designed to accelerate and direct airflow gas within the engine.

To reduce aircraft development lead-time, Safran Engineering Services is specialized in quick design and engineering in full autonomy. Teams provide global loads for ground and flight maneuvers, follows the evolution of weight and center of gravity for aircraft components and support sales campaigns with weight & balance evaluation.

Investigate the smallest of features with spatial resolution down to 600 nm – A state-of-the-art nano-focus x-ray source, precision stages, and high-quality detectors work together to deliver sub-micron resolution imaging. Perform true 4D imaging with Dynamic CT – High temporal resolution, continuous and uninterrupted scanning, and specialized 4D software tools bring synchrotron-like capabilities to the lab. Implement 3D in situ experiments – continuous sample rotation and scanning enable uninterrupted in situ experiments. Dedicated “no-cable-wrap” interfaces simplify experiment set-up. Accommodate a broad range of samples – UniTOM HR’s high power source (50W), multiple detector options (up to 3) and heavy load stage (45 kg) accommodates samples up to 500 mm diameter X 700 mm high. Maximize system utilization and throughput – A fast frame rate detector and a high flux x-ray source combine for high temporal resolution tomography giving you the ability to scan more samples and accommodate more users.

A next-generation Advanced Air Mobility (AAM) aircraft currently under development, designed with a separable upper platform and lower mission module structure. The interchangeable lower modules can be configured for passenger transport, cargo delivery, or reconnaissance missions, offering exceptional operational flexibility across various applications. As a large-scale platform, it embodies the future of modular air mobility, enabling rapid mission conversion, efficient maintenance, and cost-effective operation for both urban and regional air mobility sectors.

The ACTUS® IR Flashlight emits a low output of less than 100mW with a wavelength range of 830 to 875 nm, classified as a Class 3B laser. Designed for reliable performance in extreme environments, it can withstand specific storage and operating temperature ranges. Powered by a single CR123A lithium battery, it offers extended operational time, while its robust 6061-T6 aluminum construction ensures durability. The lightweight, compact design makes it easy to carry and use in the field.

The KX2-2046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 20W saturated output power with power-added efficiency of 46%. The KX2-2046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX2-2046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-11.5GHz - Small Signal Gain: 26dB - High Pout: 20W - High PAE: 46% - DC bias: Vd=28V @Idq=0.3A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x1.66x0.1mm  

1. Machining • Small, medium, and long bed machining available, with sizes up to 20 meters • Precision 5-axis machinery supporting 4m, 6m, 8m, and 20m machining beds. • Capable of machining both hard and soft metals 2. Sheet Metal Fabrication • Roll forming (11m), skin stretch forming (10m) • Bladder and stretch wrap forming • Skin milling & NC routing 3. Composite • Specialized Curing Oven up to 15M • Layup Facility 4. In-house Heat Treatment Facility (NADCAP Accredited) Highlights √ Proven Korea Defense Offset Partner for Global OEM √ Integrated Global Program Operation in Korea and USA Facilities √ Boeing & Lockheed Martin Award Winning Supplier Project Highlight : • A32X/A330 Skin Structure, Floorgrid, Doors • KT-100 Full aircraft Integration • Helicopter Fuselage, Torque Box, Bulkhead, Leading Edge etc.

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.