The world’s most advanced and mature high-performance ultraminiature connectors, the Series 80 Mighty Mouse matches the electrical and mechanical performance of popular mil-standard connectors, but in a smaller and lighter package for tactical military, aerospace, and soldier-worn electronics. Series 804 Quick-Disconnect and Series 824 Locking Push-Pull versions offer environmental sealing and rugged design in a lightweight, push-pull package used for headsets, radios, weapons and other applications. Series 806 meets D38999 performance meeting immersion requirements and provide excellent durability, sealing, and EMI shielding at just half the size and weight of D38999. Series 811 is even higher density in the same shell size offerings. There are now over 150 insert arrangements covering the spectrum of systems requirements. The high-performance Mighty Mouse is now specified on hundreds of mission-critical soldier and mil/aero applications worldwide and continuing to add more....

Kia developed Granbird Bare Chassis Vehicle based on long-accumulated technology and infrastructure for commercial vehicles. This Granbird Bare Chassis vehicle can be easily modified as specialized vehicles on the basis of diverse customer requirements.

The HPC2812 is a rugged 6U VPX high-performance computer aligned with the compute-intensive SOSA profile, delivering top-tier processing with dual Intel® Xeon® D-2700 (Ice Lake-D) processors and flexible expansion capabilities. • Supports up to 128 GB DDR4 SDRAM with ECC and 480 GB NAND Flash (NVMe SSD) per node • Offers 2× 100 GbE (or 4× 40 GbE) data plane with RDMA, PCIe Gen 4 expansion plane, plus control and management plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security

Antimicrobial/FR treated padded spacer mesh system Low Profile Shoulder Harness Ultra-light multipurpose loading platform Applied 3 x 8 PALS system for the both cummerbund and 3 x 6 for the back panel 4 magazine pockets inside the cummerbund 2 pockets for 6"x6" hard plate inside the cummerbund Composition Material : 500D Cordura® + ARAMID / PV® Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

The NSP-2 is designed for integration on Modular-Payload (MP) compliant Unmanned Airborne Systems (UAS), and each unit undergoes thorough testing to ensure its reliability. Instead of a mechanical gimbal that requires regular maintenance, IMSAR’s NSP-2 uses an innovative 2D Electronically-Scanned Array (ESA) antenna to enable quick scanning in both azimuth and elevation. The NSP-2 works in the Ku-band using multiple modes, such as Synthetic Aperture Radar (SAR) imaging, Magnitude Change Detection (MCD), and Ground and Maritime Moving Target Indication (MTI) at low altitudes.

Localization development for general parts of Naval Logistics Command in progress

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

llumia ENGAGE facilitates open-ended training conversations using flexible AI agents to help practice 21st-century skills, decision-making and communication across multiple platforms.