Electric motor used to drive the joint (WT axis) of the Explosive Ordnance Disposal (EOD) Robot.

CarboNIX is a scalable shock-free separation system for microsats weighing between 10 and 500kg. It is available in 8'', 11,732'', 15'', 18.25'', 24'' and custom diameter sizes. CarboNIX's patented synchronous spring pusher system deploys satellites smoothly and evenly, with no unnecessary shocks or tumbling, thus minimizing risk of damage to a satellite's sensitive optical payloads and electronic components. It is the lowest-shock and lowest-tumbling separation system ever deployed in space.

TESCAN SOLARIS is a fully automated sample prep platform optimized for advanced devices with sub-10 nm features. It integrates the Triglav™ SEM, AutoTEM Pro™ software, and OptiLift™ nanomanipulator to enable hands-free, repeatable lamella prep in planar, inverted, or top-down geometries.

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Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. Welcome to Microchip, we hope to partner with you on a future project. We believe together we can accomplish anything.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.

We are one of the world's leading manufacturers of both military and commercial aircraft ground support equipment. Hydraulics International, Inc. is proud to be one of a few small companies having the total self sufficiency in the design and fabrication of aerospace ground support equipment.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.