A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

JWGE connector which was derived from the VG95234, was developed for low-voltage/high-current transmission and, when combined, exhibits IP68 water and dust resistance, also exhibiting excellent durability and mechanical performance in a temperature range of 55° to +125°C. These features are applied and utilized in military vehicles and various industrial equipment.

3U OpenVPX SSD is a rugged, reliable, high-performance NVMe SSD solution. Since the 3U OpenVPX SSD is a NAND flash-based SSD, reliability is improved in environments with vibration and contaminants compared to existing hard disk drives (HDDs). Additionally, it has the advantage of low latency and high-speed data transfer speed through the NVMe interface based on PCI Express. This is a significant advantage in high-risk combat environments.

This EGR-Cooler prototype, developed in collaboration with Hyundai Motor Company, was fabricated using EOS Stainless Steel 316L, renowned for its excellent corrosion resistance and mechanical properties in demanding automotive applications. The part was additively manufactured over a period of 64 hours, demonstrating the advanced capabilities of metal 3D printing for precision and reliability. Unlike conventional designs, this innovative component integrates 14 separate parts into a single, unified structure, greatly simplifying assembly while enhancing operational efficiency. The implementation of a Triply Periodic Minimal Surface (TPMS) structure within the cooler significantly improves heat exchange performance and enables substantial weight reduction, meeting next-generation thermal management requirements. Partners Lab stands as a leader in Korean additive manufacturing technology, offering cutting-edge capabilities in OEM production and collaborative technical development for various industrial sectors. This EGR-Cooler, designed by nTopology, exemplifies our engineering expertise and commitment to delivering high-performance thermal products for automotive and beyond.

POSITAL's incremental encoders feature a simple internal structure and provide precise positioning information, allowing customers to flexibly address any challenges they encounter in the field. POSITAL's absolute encoders are available as single-turn or multi-turn encoders, offering the advantage of selecting the right configuration for your installation environment from a variety of mechanisms and connection configurations. POSITAL's kit encoders, based on Wiegand technology, store positioning information in real time without relying on batteries, providing a smart and economical solution.

국내 최초로 GaN MMIC HPA 개발을 통한 레이다 탐지용 TR Module 개발로 핵심기술을 확보 하였으며 S ~ Ka대역 주파수 범위에 최적화된 다양한 제품을 개발, 생산하고 있습니다.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.