Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

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Kappa’s Armor Eye product family of advanced rugged camera solutions offers maximum flexibility for customized and program-specific DVE and SAS designs and integrations. The high-performance rugged vision solutions can be specifically configured according to the vehicle type and the mission tasks. We offer affordable Entry Level (EL) and very sensitive and wide dynamic High Quality (HQ) camera products. Benefit from our project-specific flexibility to adapt view angles and DRI performance for the best operational performance, day- and night 24/7. Turnkey Solution - DVE- und SAS Systems with DVU - Digital Video Distribution Unit DVE systems with up to two cameras can be built as direct camera-monitor systems (CMS). For the integration of a larger number of cameras, our advanced VDU represents the signal processing core for all Kappa’s turnkey AE DVE & SAS systems. This high-speed and digital FPGA based processing core offers multiple HD-SDI camera inputs and several HD-SDI outputs for lowest system latency performance glass-to-glass. Additional control and H.264 IP streaming interfaces greatly increase the VDU flexibility and enable information sharing between vehicles. Controlled by the crew or the gearbox switch, the VDU processes the selected camera channels, mixes and scales multiple camera information, performs driver assistance and tactical overlays of text and icons, and fi nally routes the selected view data to the respective output for display on the cockpit monitors. Best in class signal processing techniques and scaling algorithms guarantee the low latency generation of crisp and sharp images even under severe difficult ambient light conditions. Day & Night Vision (VIS/LWIR), image fusion, near-zero latency, scalable solutions up to 360° surround-view, adaptable FoV.

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

TERRAPIN X is a rugged handheld laser rangefinder by Safran Vectronix, offering up to 3,000 m range with 8× magnification, Class 1 eye-safe laser (905 nm), and a 28 mm objective lens. It features precise beam divergence (1.2 × 0.5 mrad), slope and azimuth compensation, scan mode (≥2 readings/sec), and durable Ryton® housing with shock-resistant rubber armor (IP67). Advanced Bluetooth connectivity integrates with mobile apps and devices such as Kestrel LiNK, Garmin, Strelok Pro, and includes a dedicated smartphone app.

The SBC6511 Rugged Single Board Computer(SBC) from Abaco Systems features the new high performance, highly integrated Intel® Xeon® E processor (‘Coffee Lake Refresh’). Powered by Intel® Xeon® W processors, offering robust computational power. • Supports up to 64 GB DDR4 SDRAM with ECC and up to 256 GB (or in some variants up to 480 GB) NVMe SSD storage • Offers high-throughput networking: Dual 40 GbE data-plane (KR4 “fat pipes”) • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA (ZU7EG) for enhanced security

High-Reliability Space-grade SRAM memory : 1. Density : 16Mbit (512k x 32bit) SRAM 2. Package Type : 100 Pin CQFP (Ceramic Quad Flat Package) 3. MIL-PRF-38535 Class V Qualified 4. Operating Temperature : -40℃ ~ +125℃ 5. Radiation : TID > 102 krad, SEL LETth > 80.4MeVcm2/mg@ 85℃

ABC leader in test bench has, through the acquisition of CAPRA, skills and experience in the manufacture and production of electronic cards. In the world of the special machine some demands exceed or do not match with the characteristics of standard components. In this case ABC is able to meet these needs.