The VPX3-C11 which provides a full 3U OpenVPX(VITA 65) is a Single Board Computer(SBC) that combines the power, versatility, cost-effectiveness of the 11th generation Intel Xeon W processor and RM590E PCH chipset with the reliability. VPX3-C11 is based on the Intel Xeon W- 11865MLE CPU that has 8 cores running at max 4.5GHz and providing 32Gbytes of high-bandwidth DDR4 SDRAM. Intel Xeon processor includes an integrated Intel UHD Graphics 11th Gen(32 EU) graphics engine, providing discrete GPU performance with OpenGL for graphicsintensive applications. For storage application VPX3-C11 provides the built-in 80GB SLC NVMe SSD solution via PCIe x4 lanes as well as the external SATA expansion through VPX site. The VPX3-C11 satisfies the demanding applications ranging from tactical aircraft to armoured vehicles to rugged industrial systems, with its rich complement of features and I/O including Intel Graphics, Integrated Platform Management Interface, Gigabit Ethernet, DIO, Serial channels, USB ports and more. Especially VPX3-C11 was designed to keep the pin compatibility with VPX3-C11, previous 6th Generation model in terms of I/O interface signal arrangement.

This EGR-Cooler prototype, developed in collaboration with Hyundai Motor Company, was fabricated using EOS Stainless Steel 316L, renowned for its excellent corrosion resistance and mechanical properties in demanding automotive applications. The part was additively manufactured over a period of 64 hours, demonstrating the advanced capabilities of metal 3D printing for precision and reliability. Unlike conventional designs, this innovative component integrates 14 separate parts into a single, unified structure, greatly simplifying assembly while enhancing operational efficiency. The implementation of a Triply Periodic Minimal Surface (TPMS) structure within the cooler significantly improves heat exchange performance and enables substantial weight reduction, meeting next-generation thermal management requirements. Partners Lab stands as a leader in Korean additive manufacturing technology, offering cutting-edge capabilities in OEM production and collaborative technical development for various industrial sectors. This EGR-Cooler, designed by nTopology, exemplifies our engineering expertise and commitment to delivering high-performance thermal products for automotive and beyond.

Phased Array Multi Function Antenna including Radome

Each Snowball Edge device can transport data at speeds faster than the internet. This transport is done by shipping the data in the devices through a regional carrier. The appliances are rugged, complete with E Ink shipping labels. Snowball Edge devices have two options for device configurations—Storage Optimized 210 TB and Compute Optimized.

Safran’s TG600 is a 600 kW hybrid-electric turbogenerator—derived from the Arrano turboshaft and paired with GENeUS generators—designed to serve as the core propulsion component for Electra’s nine‑passenger eSTOL aircraft.

1. Comprehensive Manufacturing • Prototyping to serial manufacturing • Structure Assembly and Wire Harness • System Integration - Motors, Flight Control System, Inverter, etc. 2. Multi-Mission Drones • Precise Attack Drone • Heavy Lift Drones ( Cargo/transport) • Firefighting/ Rescue Drone Highlights Experienced in prototyping and manufacturing drones for diverse customer requirements.

6 Series Mixed Signal Oscilloscope; (4) FlexChannels with 62.5M record length, 1-year warranty, Certificate of Traceable Calibration Standard

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm